|Product Name:||8w/M.K Thermal Conductivity Pink Thermal Pad Material For Electronics Heat Transfer||Composition:||Ceramic Filler + Silicone|
AOK Thermal Pad Material,
Nontoxic Thermal Pad Material,
Shockproof Thermal Heat Transfer Pads
TP 800 Series thermal pad material is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
The thermal pad material is used to fill the air gap between the heating device and the heat sink or metal base. Their flexible and elastic characteristics enable it to cover very uneven surfaces. The heat is transmitted from the separation device or the whole PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of the heating electronic components. In the use of gaskets, pressure and temperature restrict each other. With the increase of temperature, after the equipment operates for a period of time, the thermal pad material will soften, creep and stress relaxation, and the mechanical strength will also decrease, and the sealing pressure will decrease.
As one of the thermal interface materials, thermal pad has obvious advantages over other thermal interface materials. Firstly, the thermal pad is compressible, soft and elastic, and has the function of cushioning and shockproof for the application environment under low pressure; Secondly, the thermal pad has certain self-adhesive. For applications that do not need high viscosity, it is not necessary to apply additional adhesive on the surface of the heat-conducting gasket.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ Good processing performance, convenient installation and pressing;
■ It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan