|Product Name:||Pink High Thermal Conductivity Thermal Pad Silicone Material For Robots||Composition:||Silicone|
Multipurpose Thermal Silicone Pad,
Electronics Thermal Silicone Pad,
Nontoxic Thermal Pad For Electronics
Pink High Thermal Conductivity Thermal Pad Silicone Material For Robots
With the "new infrastructure" fast forward button pressed, thanks to the support of 5g network, big data, artificial intelligence algorithms and other technologies, robots are ushering in a new round of development. Smart home robots, unmanned distribution robots, intelligent guidance robots and so on, a series of robots close to daily life have become a new favorite. Although it is far less than the fictional anthropomorphic machine in science fiction, the real robot has replaced the artificial in the important link of intelligent production and become an efficient production mode. Before being put into the market, intelligent robots mainly realize specific functions. Robots involving intelligent recognition and interaction are usually realized by connecting AI algorithm chips. There will be sensors and processing chips on the robot motherboard, which will generate a lot of heat during use. If the heat is not dissipated in time, the equipment will continue to heat up, which is easy to cause overheating and damage of devices.
Like most electronic products, robots also need to maintain stable operation through heat dissipation. The main board controller structure will be equipped with a radiator according to the location of the heat source. In the middle, a thermal conductive interface material is required to conduct heat. We recommend that the thermal pad silicone material be installed at the bottom of the PCB corresponding to the chip to be dissipated, between the chip heat source and the radiator to be dissipated between the shell and the chip. The characteristics of soft thermal conductive silica gel sheet material determine that it has a good filling effect. In particular, a certain amount of compression can make the thermal resistance smaller and the thermal conductivity better. At the same time, the material itself also has good electrical insulation effect and shock absorption effect, and the use of thermal conductive silicon film is very convenient, not easy to lose, and convenient for the installation of heat dissipation module.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ Good processing performance, convenient installation and pressing;
■ It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan