|Product Name:||8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch||Composition:||Silicone|
|Hardness(shore Oo):||55||Thermal Conductivity:||8.0 ± 0.5 W/m.K|
|Thickness:||0.5 ~ 10 Mm||Density:||3.35 G/cc|
RoHS Thermal Pad Material,
Reusable Thermal Pad Material,
8W/MK Reusable Thermal Pad
8.0 W/m.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch
With the rapid development of science and technology, our society has entered the information age. In this society, the network has become an indispensable part of people's life. With the rapid development of the information age and the gradual popularization of cloud services, the amount of data storage in all walks of life has increased rapidly due to the popularization of cloud services. Large capacity expansion of servers also brings more switch requirements. Network switch is an important component to connect servers and network equipment and build data center. Due to the high density of network devices caused by the popularity of cloud services, the surge in the number of connected devices makes the switch load greater. Due to the fatal impact of high temperature on industrial switches, in the design of such products, in addition to selecting industrial components with wide temperature range, we should pay more attention to the thermal design of equipment.
In order to meet the reliability application requirements of industrial switches, most of the whole machine adopts the fan less heat dissipation design. For chips with large heat generation, Thermal Pad Silicone Material can be used to fill the gap between the contact surface and form a heat conducting channel from the chip surface to the shell, so as to ensure that the chip works in a safe temperature range and that the switch can work reliably and safely in a high temperature environment. The Thermal Pad Silicone Materialis mainly used for heat conduction and heat dissipation between the main board and the shell. The main purpose of selecting the Thermal Pad Silicone Material is to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator. The Thermal Pad Silicone Material can well fill the gap of the contact surface; With the supplement of Thermal Pad Silicone Material, the contact surface between the heat source and the radiator can be in better and full contact, so as to truly achieve face-to-face contact, and the temperature response can achieve the minimum temperature difference; The Thermal Pad Silicone Material not only has the insulating property, but also has the effect of shock absorption and sound absorption.
■ Thermal conductivity:8.0 W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ Good processing performance, convenient installation and pressing;
■ It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5 mm,size=200 mm * 400 mm; T＞1.5 mm,size=150 mm * 150 mm; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25 mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan