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Product Details:
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| Product Name: | 8.0W/m.K Thermal Conductivity Low Volatility Silicone Thermal Pad Material For EV | Composition: | Ceramic Filler + Silicone |
|---|---|---|---|
| Thermal Conductivity: | 8.0W/m.K | Density: | 3.35 (g/cc) |
| Hardness: | 55±10(Shore OO) | Dielectric Constant: | 7.2（@10mhz） |
| High Light: | 3.35G/CC Thermal Pad Material,Anticorrosive Thermal Pad Material,EV Thermal Pad Silicone |
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8.0W/m.K Thermal Conductivity Low Volatility Silicone Thermal Pad Material For EV
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic Filler + Silicone | - |
| Color | Pink | Visual |
| Thickness(mm) | 0.5~10 | astm d374 |
| Density(g/cc) | 3.35 | ASTM D792 |
| Hardness(shore oo) | 55±10 | ASTM D2240 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ＞6.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.2 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1012 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 8.0±0.5 | ASTM D5470 |
Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Contact Person: Jason Zhan
Tel: +8613923884646
