|Product Name:||8.0W/M.K Thermal Conductivity Low Volatility Silicone Thermal Pad Material For EV||Composition:||Ceramic Filler + Silicone|
|Thermal Conductivity:||8.0W/m.K||Density:||3.35 (g/cc)|
|Hardness:||55±10(Shore OO)||Dielectric Constant:||7.2（@10mhz）|
3.35G/CC Thermal Pad Material,
Anticorrosive Thermal Pad Material,
EV Thermal Pad Silicone
8.0W/M.K Thermal Conductivity Low Volatility Silicone Thermal Pad Material For EV
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
As a passive heat dissipation medium, thermal pad material only plays a role of heat conduction in the battery pack, which has no direct relationship with the heat dissipation and packaging methods of these new energy vehicle battery packs. However, the battery of new energy vehicles keeps discharging and charging during operation. The temperature of the battery pack of new energy vehicles changes at any time during the whole working process, and the change is uneven. Local temperature is often too high or local cooling is uneven. The uneven internal temperature of the battery pack needs to be solved immediately. This is the time when thermal conductive silicon pad is needed.
Thermal pad material can be embedded between cells, between battery modules, or between battery modules and battery shells. As long as there is a temperature difference or a large thermal resistance at any position, the thermal conductive pad can transfer the temperature from high temperature to low temperature through its good thermal conduction, and reduce the temperature difference as much as possible until the new energy vehicles reach the safe operating temperature.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan