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Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material

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Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material

Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material
Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material

Large Image :  Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material

Description
Product Name: 8w/M.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger Composition: Silicone
Flammability: V-0 Thermal Conductivity: 8.0±0.5(W/m.K)
Thickness: 0.5~10(mm) Density: 3.35 (g/cc)
High Light:

Ultrasoft Conductive Silicone Pad

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Odorless Conductive Silicone Pad

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Heatproof Thermal Gap Filler Material

8w/M.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger

 

At present, wireless charging technology breaks through the traditional connection line charging. It is a wireless charging technology using intelligent power transmission, which improves the charging efficiency and convenience. Mobile phone wireless charging has been widely recognized, and its utilization rate is also rising. Due to its small size, the working temperature of the internal electronic components of the wireless charger needs to be solved first. The Thermal Pad Silicone Material provides its heat dissipation solution to solve this important problem.


The surface of Thermal Pad Silicone Material has certain flexibility, excellent insulation, compressibility and natural viscosity. It is specially designed for the design scheme of heat transfer through gaps. It can fill the gap, complete the heat transfer between heating parts and cooling parts, and also play the role of insulation, vibration reduction, sealing, etc., which can meet the design requirements of equipment miniaturization. With manufacturability and practicability, its thickness is applicable to a wide range, and it is a good heat conducting filler. It is widely used in electronic and electrical products to transfer the surface temperature of the heat source to the radiator and air.


In order to achieve better heat dissipation efficiency, the wireless charging base is generally made of metal materials and integrated with anti-skid pads, which lays a good foundation for the heat dissipation of internal electronic components to achieve anti-skid and wear-resistant effects. In the internal coil part of wireless charging, this part includes the part where the heat is concentrated in the middle. Therefore, the main temperature probe will be installed in the middle of the coil to ensure that the service temperature of the charger is within the specified temperature range.


Product feature
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
Good processing performance, convenient installation and pressing;
It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;

 


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub, NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Purchase information:

 

Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material 0

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

 

Ultrasoft Odorless Conductive Silicone Pad , Heatproof Thermal Gap Filler Material 1

 

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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