|Product Name:||8w/M.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger||Composition:||Silicone|
Ultrasoft Conductive Silicone Pad,
Odorless Conductive Silicone Pad,
Heatproof Thermal Gap Filler Material
8w/M.K Thermal Conductivity Thermal Pad Silicone Material For Wireless Charger
At present, wireless charging technology breaks through the traditional connection line charging. It is a wireless charging technology using intelligent power transmission, which improves the charging efficiency and convenience. Mobile phone wireless charging has been widely recognized, and its utilization rate is also rising. Due to its small size, the working temperature of the internal electronic components of the wireless charger needs to be solved first. The Thermal Pad Silicone Material provides its heat dissipation solution to solve this important problem.
The surface of Thermal Pad Silicone Material has certain flexibility, excellent insulation, compressibility and natural viscosity. It is specially designed for the design scheme of heat transfer through gaps. It can fill the gap, complete the heat transfer between heating parts and cooling parts, and also play the role of insulation, vibration reduction, sealing, etc., which can meet the design requirements of equipment miniaturization. With manufacturability and practicability, its thickness is applicable to a wide range, and it is a good heat conducting filler. It is widely used in electronic and electrical products to transfer the surface temperature of the heat source to the radiator and air.
In order to achieve better heat dissipation efficiency, the wireless charging base is generally made of metal materials and integrated with anti-skid pads, which lays a good foundation for the heat dissipation of internal electronic components to achieve anti-skid and wear-resistant effects. In the internal coil part of wireless charging, this part includes the part where the heat is concentrated in the middle. Therefore, the main temperature probe will be installed in the middle of the coil to ensure that the service temperature of the charger is within the specified temperature range.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ Good processing performance, convenient installation and pressing;
■ It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub, NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan