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2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

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2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications
2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications 2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Large Image :  2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Packaging Details: 400 mm x 200 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications

Description
Product Name: Ultra Soft Thermal Pad High Temperature Resist Adhesive With 1.0w Thermal Conductivity Usage Temperature(℃): -40 ℃ ~ 150 ℃
Color: White And Brick Red Thickness: 0.5~12.0 Mm
Tensile Strength(KN/m): 2.5 Hardness: 30±5 (Shore OO)
High Light:

2.5KN/M Ultra Soft Thermal Pad

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1W Ultra Soft Thermal Pad

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Telecommunications Thermal Pad Heat Conductivity

Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity

 

UTP series thermal pad is made of soft silica gel thermal conductive material, which has the characteristics of good thermal conductivity, insulation, softness and elasticity. It is placed between the power heating device and the heat dissipation structure to effectively transfer the heat generated by the power module to the heat dissipation components to realize the heat dissipation of the system. It has self-adhesive property and is easy to apply without additional back glue. It can be cut into any size and shape according to the requirements of application environment to meet different design needs.

 

Product features:Thermal Conductivity:1 W/m.K,Ultra Soft, Reinforced Gap Filler Pad


"Ultra Soft Thermal Pad High Temperature Resist Adhesive with 1 W/m.K thermal conductivity" is a thermal conductive medium material synthesized by special process with silica gel as the base material and metal oxide and other auxiliary materials. In the industry, it is also known as thermal conductive silica gel pad, thermal silicon film, soft thermal conductive pad, thermal conductive silica gel pad and so on.

 

The thermal gap material has good softness (compressibility) and can fill the variable gap between multiple components and the universal heat sink, while only causing extremely low pressure on the components. The surface of the thermal pad has good tackiness and minimizes the thermal contact resistance between the component and the heat sink.

 

 

Product feature:
■ Thermal Conductivity:1.0 W/mK
■ Ultra soft and highly compliant
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ High cut through resistance
■ High breakdown voltage
thermal silicone sheet on the structure of the process difference bridge, reduce the process difference requirements of the radiator and heat dissipation structure;
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications 0

Standard size: 200 mm * 400 mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25 mm

 

 

2.5 KN/M 1W/m.K Ultra Soft Thermal Pad Heat Conductivity For Telecommunications 1

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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