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100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads

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The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads

100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads
100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads 100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads

Large Image :  100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads

Description
Product Name: Ultra Soft Thermal Pad 100x100x1mm Silicone SSD CPU FPU LED Heatsink PC Cooling Pad Breakdown Voltage(kv/mm): ≥7.0
Volume Resistivity(Ω.cm): 1.0*10^13 Thickness: 0.5~12.0 (mm)
Density: 2.5(g/cc) Hardness: 30±5(Shore OO)
High Light:

100mm SSD Thermal Pad

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1mm SSD Thermal Pad

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Silicone Thermally Conductive Interface Pads

Ultra Soft Thermal Pad 100x100x1mm Silicone SSD CPU FPU LED Heatsink PC Cooling Pad

thermal conductive silicone is specially designed for use of gap heat transfer scheme, can fill the gap, to complete the heat transfer between the heating parts and cooling parts, also play a role such as insulation, shock absorption, seal, can meet the design requirements of the device miniaturization, is extremely manufacturability and practicability, and the thickness of the applicable Fan Guang, is a kind of excellent thermal conductive filler material is widely used in electrical and electronic products.

 

thermal pad is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap, open the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption and sealing. It can meet the design requirements of miniaturization and ultra-thin equipment. It is an excellent heat conduction filling material with great processability and usability, and wide thickness application range.

 

It is mainly made of silica gel. Silica gel itself has no pollution, no special smell and will not harm human body. In addition, from its performance, it is installed in electronic products as an accessory for heat transfer. The temperature of electronic products is in a relatively stable state in the use engineering, which is not only to protect the machine, but also from the point of view of safety. It has insulating properties, so it will not cause harm in the process of using electronic products, and it also has the function of shock and fall prevention.

 

Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

 

Product feature:
■ Thermal Conductivity:1.0 W/ mK
■ Ultra soft and highly compliant
■ Naturally tacky on one side
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
thermal silicone sheet has insulation performance (the characteristics need to add appropriate materials in the production);
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

100x100x1mm SSD Thermal Pad , Silicone Thermally Conductive Interface Pads 1

 

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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