|Product Name:||0.5mm Thickness Pink Silicone Thermal Pad Material For Led Lighting||Thickness:||0.5~10(mm)|
|Composition:||Ceramic Filler + Silicone||Color:||Pink|
|Usage Temperature:||-40~150（℃）||Breakdown Voltage:||≥6.0（kv/mm）|
Weather Resistant Thermal Sheet CPU,
Silicone Thermal Sheet CPU,
Odorless Electrical Insulation Sheet Material
0.5mm Thickness Pink Silicone Thermal Pad Material For Led Lighting
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
Thermal Pad Material is a material with high thermal conductivity and high cost performance. It is a thermal conductive filling material with natural micro viscosity and softness on the surface. It can better fill the air gap, complete the heat transfer between the heat source and the heat sink, and comprehensively improve the thermal conductivity. It is suitable for high-performance applications. It is an ideal thermal conductive interface material.
Led Thermal Pad Material is mainly used between aluminum substrate and heat sink, between aluminum substrate and shell, etc. Today, we mainly introduce the successful application of thermal conductive silicone sheets in the LED industry: there are many kinds of LED lamps. For indoor LED lamps, thermal conductive silicone sheets with relatively low thermal conductivity are generally used, which can reduce the cost of the product and meet the needs of the product itself. For some outdoor high-power LED lamps, such as street lamps, the power is much higher than other indoor lamps, so that the lamps can better dissipate heat, At the same time, the service life of the lamp is improved. Generally, the Thermal Pad Material with relatively high thermal conductivity is used.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan