|Product Name:||Ultra Soft Ceramic Filler Thermal Pad Material With 8.0w Thermal Conductivity||Composition:||Ceramic Filler + Silicone|
|Thermal Conductivity:||8.0±0.5（W/m.K）||Hardness:||55±10(Shore OO)|
|Usage Temperature:||-40~150（℃）||Breakdown Voltage:||≥6.0（kv/mm）|
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Ultra Soft Ceramic Filler Thermal Pad Material With 8.0w Thermal Conductivity
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
The thermal pad material has the characteristics of good insulation, die-cutting, easy mass production, no chemical reaction and easy rework. However, the interface thermal resistance of the thermal pad material is higher than that of the liquid thermal conductive product, and the price is high. There is no bonding strength, and the original thickness cannot be restored after long-term use. Changing the shape of the thermal conductive interface requires changing the shape and / or thickness of the die cutting.
Some thermal pad material are very hard and brittle, such as tofu dregs, which will break when folded. However, TP series thermal pad material have low hardness, high elasticity, certain tensile strength, elongation and tear resistance, and can withstand 40% to 50% compression deformation. They have relatively low requirements for engineers' design work, which greatly facilitates production and processing.
How to select the thickness of thermal pad material? This depends on the specific application, and is also related to the pressure that the device can withstand. A compression ratio of 10-20% is enough. The general compression ratio of thermal conductive silica gel sheet is about 10-20%, and the soft thermal conductive silica gel can reach 30-40%. The greater the pressure, the greater the compression deformation, and the greater the pressure the device bears. The main function of thermal conductive silicon film is to eliminate the air between the contacts, so that they do not produce gaps, and fully contact to achieve good thermal conductivity. Thermal conductive silica gel has good contact and weak viscosity. The thinner the thermal pad material, the smaller the thermal resistance, and the better the heat conducting effect.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan