|Product Name:||2 W/m.K Thermal Conductivity Pink Thermal Conductive Pad For Electronics Heat Transfer||Composition:||Ceramic Filler + Silicone|
|Color:||Grey||Hardness:||25 (Shore OO)|
|Tensile Strength:||0.4 Kn/m||Dielectric Constant:||7.0 @10mhz|
Electronics Thermal Conductive Pad,
Grey Thermal Conductive Pad,
2W/MK Heat Transfer Pad
TP200 thermal conductive pad is a compliant thermal gap filler designed to provide moderate thermal performance. The pad is low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. TP200 is easy handling and converting process and reusable special property. As a kind of flexible heat conducting material, TP series is widely used in the gap filling between heating elements and radiating elements. In addition to the role of interface heat transfer, it can also play the role of insulation, shock absorption and buffer, absorption tolerance and so on.
TP200 thermal conductive pad is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly.It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.
thermal pad is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap, open the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption and sealing. It can meet the design requirements of miniaturization and ultra-thin equipment. It is an excellent heat conduction filling material with great processability and usability, and wide thickness application range.
Soft and flexible, low hardness, wide range of thickness, can fill any uneven size gap
Meet ROHS,UL and SGS environmental requirements.
Naturally tacky, easing application
Low pressure versus deflection
Low viscosity on both sides, easy to install and reusable
Networking and Telecommunications
IT: Notebooks, Tablets, Power Conversion
Industrial: LEDs, Power Supplies and Conversion
Automotive: Control Modules, Turbo Actuators
Consumer Electronics: Gaming Systems, and LCDs
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||25||ASTM D2240|
|Breakdown Voltage(Kv/mm)||6.0||ASTM D149|
|Dielectric Constant(@10Mhz)||7.0||ASTM D150|
|Volume Resistivity(Ω.cm)||10^13||ASTM D257|
|Thermal conductivity(W/m.K)||2.0||ASTM D5470|
Contact Person: Jason Zhan