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2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

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2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer
2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer 2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Large Image :  2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP200
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Packaging Details: 400 mm x 200 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer

Description
Product Name: 2 W/m.K Thermal Conductivity Pink Thermal Conductive Pad For Electronics Heat Transfer Composition: Ceramic Filler + Silicone
Color: Grey Hardness: 25 (Shore OO)
Tensile Strength: 0.4 Kn/m Dielectric Constant: 7.0 @10mhz
High Light:

Electronics Thermal Conductive Pad

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Grey Thermal Conductive Pad

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2W/MK Heat Transfer Pad

 

TP200 thermal conductive pad is a compliant thermal gap filler designed to provide moderate thermal performance. The pad is low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. TP200 is easy handling and converting process and reusable special property. As a kind of flexible heat conducting material, TP series is widely used in the gap filling between heating elements and radiating elements. In addition to the role of interface heat transfer, it can also play the role of insulation, shock absorption and buffer, absorption tolerance and so on.


TP200 thermal conductive pad is a universal and economical thermal sealing gasket with high cost performance, soft, self-adhesive and easy assembly.It shows good thermal conductivity and electrical insulation performance under low-pressure compression force. It paves the gap between the heating device and the heat sink or the machine shell, extrudes air to achieve full contact, and forms a continuous heat conduction channel. Using the heat sink or the machine shell as the heat sink, the heat dissipation area can be effectively improved, so as to effectively improve the heat dissipation effect.
 
thermal pad is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap, open the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption and sealing. It can meet the design requirements of miniaturization and ultra-thin equipment. It is an excellent heat conduction filling material with great processability and usability, and wide thickness application range.
 
 
Product feature:

  • Soft and flexible, low hardness, wide range of thickness, can fill any uneven size gap

  • Meet ROHS,UL and SGS environmental requirements.

  • Naturally tacky, easing application

  • Low pressure versus deflection

  • Low viscosity on both sides, easy to install and reusable

Typical applications:

  • Networking and Telecommunications

  • IT: Notebooks, Tablets, Power Conversion

  • Industrial: LEDs, Power Supplies and Conversion

  • Automotive: Control Modules, Turbo Actuators

  • Consumer Electronics: Gaming Systems, and LCDs

Purchase information:
 
2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer 0
 
 
2 W/m.K Grey Thermal Conductive Pad For Electronics Heat Transfer 1 
 
 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Grey Visual
Thickness(mm) 0.5~10.0 astm d374
Density(g/cc) 2.8 ASTM D792
Hardness(shore oo) 25 ASTM D2240
Elongation(%) >100 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(Kv/mm) 6.0 ASTM D149
Dielectric Constant(@10Mhz) 7.0 ASTM D150
Volume Resistivity(Ω.cm) 10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 2.0 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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