Home ProductsThermal Pad Material

Multiscene CPU Thermal Pad Material Weather Resistant Pink Color

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

I'm Online Chat Now

Multiscene CPU Thermal Pad Material Weather Resistant Pink Color

Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
Multiscene CPU Thermal Pad Material Weather Resistant Pink Color
Multiscene CPU Thermal Pad Material Weather Resistant Pink Color Multiscene CPU Thermal Pad Material Weather Resistant Pink Color Multiscene CPU Thermal Pad Material Weather Resistant Pink Color

Large Image :  Multiscene CPU Thermal Pad Material Weather Resistant Pink Color

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Packaging Details: 400 mm x 200 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

Multiscene CPU Thermal Pad Material Weather Resistant Pink Color

Description
Product Name: 8.0W/m.K Thermal Conductivity Pink Thermal Pad Silicone Material For CPU Composition: Silicone
Color: Pink Thermal Conductivity: 8.0W/m.K
Dielectric Constant(@10mhz): 7.2 Density: 3.35 (g/cc)
High Light:

Multiscene Thermal Pad Material

,

CPU Thermal Pad Material

,

Pink CPU Thermal Pad

8.0W/m.K Thermal Conductivity Pink Thermal Pad Silicone Material For CPU

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 1012 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470
 

 

Product feature
■ Thermal conductivity:8.0W/m.K
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
Good processing performance, convenient installation and pressing;
It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;

 


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Multiscene CPU Thermal Pad Material Weather Resistant Pink Color 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)