|Product Name:||Single Part 3w/M.K Silicone Thermal Conductivity Gap Filler For Gaming Systems||Composition:||Ceramic Filler + Silicone|
|Thermal Resistance:||0.3 (℃-in2/W)0.1mm@50psi||Dielectric Constant:||7.3（@10mhz）|
Silicone Thermal Conductivity Gap Filler,
Multiscene Thermal Conductivity Gap Filler,
Flame Retardant Silicone Thermal Gap Filler
Single Part 3w/M.K Silicone Thermal Conductivity Gap Filler For Gaming Systems
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
Product features:One-part dispensable gap filler, Thermal conductivity: 1.0-6.0 W/m.k
Typical applications:Consumer Electronics: Gaming Systems, LCD TVs, Displays
Thermal Conductivity Gap Filler is a kind of high-performance mud like heat conducting material. It is made of silica gel as the matrix and filled with a variety of high-performance ceramic powders. The heat conducting mud has the characteristics of high thermal conductivity, low thermal resistance, good adhesion on heat dissipation parts, permanent non drying, insulation, automatic filling of gaps, increasing limited contact area, and infinite compression. It is mainly used in lighting, new energy, UAV, automobile industry, communication industry, power supply, consumer electronics, etc.
Thermal Conductivity Gap Filler is usually white or blue in appearance and feels like a child's plasticine. During the manufacturing process, the macromolecular structure in the thermal conductivity gap filler is connected into a network, effectively preventing the leakage of polymer silicone oil. Therefore, the volatility and oil leakage rate of the heat transfer mud are very low. The insulating properties of the thermal conductivity gap filler are greatly increased due to the interconnection of its internal molecules. The breakdown voltage of the 1mm thick heat conducting mud can reach 10kV. Moreover, silicon material is a stable material in nature. The service temperature of thermal conductivity gap filler is -50 ℃ to 200 ℃, and it will never become dry and invalid.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan