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Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

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Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules
Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Large Image :  Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TM300
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules

Description
Product Name: Silicone Thermal Conductive Gap Filler With Good Insulation For LED Composition: Ceramic Filler + Silicone
Usage Temperature: -40~150(℃) Thermal Resistance: 0.3 (℃-in2/W)0.1mm@50psi
Dielectric Constant: 7.3(@10mhz) Thermal Conductivity: 3.0(W/m.K)
High Light:

Anti Insulation Thermal Conductive Gap Filler

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Memory Modules Thermal Conductive Gap Filler

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LED Chips Thermally Conductive Filler

Silicone Thermal Conductive Gap Filler With Good insulation For LED

 

TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications. Thermal conductivity gap filler is widely used in LED chips, communication equipment, mobile phone CPU, memory modules, IGBT and other power modules and power semiconductors.
Product features:One-part dispensable gap filler, Thermal conductivity: 1.0-6.0 W/m.k
Typical applications:Consumer Electronics: Gaming Systems, LCD TVs, Displays

 

usage of Thermal conductivity gap filler

 

When using the manual thermal conductive adhesive, the nozzle cover shall be unscrewed, the screw thread mixing head shall be connected, the rubber hose shall be clamped on the bayonet of the AB glue gun, and the AB glue shall be extruded to the mixing head by the glue gun, and the uniform mixing shall be completed under the guidance of the screw thread (a/b two colors shall be mixed into a uniform color). Finally, the evenly mixed thermal conductive adhesive shall be spotted to the heating position according to the heat dissipation structure design. For dispensing type, follow the operating instructions of the dispenser.

 

the curing time starts from the contact between the A and B glue mixing heads. The viscosity will increase in 5 minutes, dry in 10 minutes, and gradually harden and become elastic in 30 minutes to 3 hours, which shows that the hardness will continue to increase until it does not change.

reliability the heat conductive adhesive after curing is equivalent to the heat conductive silica gel sheet. It has good high temperature resistance and aging resistance, and can work at -40~150 ℃ for a long time.

special attention should be paid to the difference between Thermal conductivity gap filler and adhesive adhesive. Its adhesive force is weak and cannot be used to fix the heat dissipation device

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Anti Insulation Thermal Conductive Gap Filler For LED Chips / Memory Modules 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^14 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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