|Product Name:||Silicone Thermal Conductive Gap Filler With Good Insulation For LED||Composition:||Ceramic Filler + Silicone|
|Usage Temperature:||-40~150（℃）||Thermal Resistance:||0.3 (℃-in2/W)0.1mm@50psi|
|Dielectric Constant:||7.3（@10mhz）||Thermal Conductivity:||3.0（W/m.K）|
Anti Insulation Thermal Conductive Gap Filler,
Memory Modules Thermal Conductive Gap Filler,
LED Chips Thermally Conductive Filler
Silicone Thermal Conductive Gap Filler With Good insulation For LED
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications. Thermal conductivity gap filler is widely used in LED chips, communication equipment, mobile phone CPU, memory modules, IGBT and other power modules and power semiconductors.
Product features:One-part dispensable gap filler, Thermal conductivity: 1.0-6.0 W/m.k
Typical applications:Consumer Electronics: Gaming Systems, LCD TVs, Displays
usage of Thermal conductivity gap filler
When using the manual thermal conductive adhesive, the nozzle cover shall be unscrewed, the screw thread mixing head shall be connected, the rubber hose shall be clamped on the bayonet of the AB glue gun, and the AB glue shall be extruded to the mixing head by the glue gun, and the uniform mixing shall be completed under the guidance of the screw thread (a/b two colors shall be mixed into a uniform color). Finally, the evenly mixed thermal conductive adhesive shall be spotted to the heating position according to the heat dissipation structure design. For dispensing type, follow the operating instructions of the dispenser.
the curing time starts from the contact between the A and B glue mixing heads. The viscosity will increase in 5 minutes, dry in 10 minutes, and gradually harden and become elastic in 30 minutes to 3 hours, which shows that the hardness will continue to increase until it does not change.
reliability the heat conductive adhesive after curing is equivalent to the heat conductive silica gel sheet. It has good high temperature resistance and aging resistance, and can work at -40~150 ℃ for a long time.
special attention should be paid to the difference between Thermal conductivity gap filler and adhesive adhesive. Its adhesive force is weak and cannot be used to fix the heat dissipation device
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan