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Anticorrosive Liquid Thermal Gap Filler Heatproof Anti Seismic

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Anticorrosive Liquid Thermal Gap Filler Heatproof Anti Seismic

Anticorrosive Liquid Thermal Gap Filler Heatproof Anti Seismic
Anticorrosive Liquid Thermal Gap Filler Heatproof Anti Seismic Anticorrosive Liquid Thermal Gap Filler Heatproof Anti Seismic

Large Image :  Anticorrosive Liquid Thermal Gap Filler Heatproof Anti Seismic

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TM300
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Anticorrosive Liquid Thermal Gap Filler Heatproof Anti Seismic

Description
Product Name: TM300 Single Part 3w Thermal Conductivity Gap Filler With Ceramic Filler And Silicone Composition: Ceramic Filler + Silicone
Thermal Conductivity: 3.0(W/m.K) Usage Temperature: -40~150(℃)
Thermal Resistance: 0.3 (℃-in2/W)0.1mm@50psi Flammability: V-0
High Light:

Anticorrosive Thermal Gap Filler

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Heatproof Thermal Gap Filler

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Anti Seismic Liquid Gap Filler

TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
Product features:One-part dispensable gap filler, Thermal conductivity: 1.0-6.0 W/m.k
Typical applications:Consumer Electronics: Gaming Systems, LCD TVs, Displays 

 

Thermal conductivity gap filler shows good adaptability when used. It can adapt to various climates and work normally at high and low temperatures. It can work for a long time without damage in various low temperature environments. The surface affinity of the heat conducting gap filler is very good, which makes its hardness very small and shows strong plasticity. It can fill materials of various shapes and compress the thickness very low, So its heat transfer coefficient is very low, its insulation is very good, and its many characteristics make it better meet various use needs.

 

Thermal conductive gap filler shows many characteristics when used. People can use it to conduct fixed-point and quantitative operations and complete automatic product manufacturing. Therefore, it is often used to replace manual production to ensure product quality. Now the chips in LED products are filled with thermal conductive gel, and the CPU in mobile phones is also filled with thermal conductive gel. Now many storage modules Semiconductors also use it.
At present, heat conducting gel is widely used. It is an advanced heat conducting material. It shows good characteristics in the process of use and can adapt to a variety of different environments. Therefore, it is now widely used in various fields.

 

 

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Anticorrosive Liquid Thermal Gap Filler Heatproof Anti Seismic 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^14 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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