|Product Name:||TM300 Single Part 3w Thermal Conductivity Gap Filler With Ceramic Filler And Silicone||Composition:||Silicone|
|Thermal Conductivity:||3.0（W/m.K）||Usage Temperature:||-40~150（℃）|
UL Electrically Conductive Gap Filler,
Pink Electrically Conductive Gap Filler,
Anti Vibration Thermal Conductive Filler
Pink Silicone Thermal Conductivity Gap Filler Usage Temperature -40~150(℃)
Compared with the thermal conductive pad, the thermal conductive gap filler is softer and has better surface affinity. It can be compacted to a very low thickness, which significantly improves the heat transfer power and can be compacted to 0.1mm. It is a new gap filler like heat conducting material formed by mixing, mixing and packaging of silica gap filler composite heat conducting filler. It is very convenient to use the mixing nozzle when selecting the dispensing plan, which can realize automatic manufacturing at the same time.
In addition, the thermal conductive gap filler also has good high and low temperature resistance, weather resistance, radiation resistance and excellent dielectric function. It is non-toxic, non corrosive, odorless and non sticky. Maintain the state of jelly during long-term application under temperature. It can be kneaded into various forms according to the requirements, and added between the electronic components requiring heat conduction and the radiator or shell to make them closely touch, reduce the thermal resistance, quickly and effectively reduce the temperature of the electronic components, and then extend the service life of the electronic components and increase their reliability.
Use the core advantages of thermal conductive gap filler:
1: It is easy to use and has strong plasticity. The high thermal conductivity gap filler is paste like and will not be dry, solid and viscous. It does not need to take special account of product size and public service restrictions during development. It can be flexibly planned according to the plan.
2: Thermal conductivity gap filler has high thermal conductivity, which can greatly improve the heat dissipation function.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan