|Product Name:||Single Part Thermal Conductivity Gap Filler With Silicone UL94V-0 Flammability||Composition:||Silicone|
|Flammability:||UL94V-0||Thermal Resistance:||0.3 (℃-in2/W)0.1mm@50psi|
|Dielectric Constant(@10mhz):||7.3||Breakdown Voltage(kv/mm):||≥5.0|
2Part Thermal Conductive Gap Filler,
Multiscene Thermal Conductive Gap Filler,
Anticorrosive 2 Part Gap Filler
Single Part Thermal Conductivity Gap Filler With Silicone UL94V-0 Flammability
Compared with the thermal conductive pad, the thermal conductivity gap filler is softer and has better surface affinity. It can be compacted to a very low thickness, which significantly improves the heat transfer power and can be compacted to 0.1mm. It is a new gel like heat conducting material formed by mixing, mixing and packaging of silica gel composite heat conducting filler. It is very convenient to use the mixing nozzle when selecting the dispensing plan, which can realize automatic manufacturing at the same time.
In addition, the thermal conductivity gap filler also has good high and low temperature resistance, weather resistance, radiation resistance and excellent dielectric function. It is non-toxic, non corrosive, odorless and non sticky. Maintain the state of jelly during long-term application under temperature. It can be kneaded into various forms according to the requirements, and added between the electronic components requiring heat conduction and the radiator or shell to make them closely touch, reduce the thermal resistance, quickly and effectively reduce the temperature of the electronic components, and then extend the service life of the electronic components and increase their reliability.
Use the core advantages of thermal conductivity gap filler:
1: It is easy to use and has strong plasticity. The high thermal conductivity gap filler is paste like and will not be dry, solid and viscous. It does not need to take special account of product size and public service restrictions during development. It can be flexibly planned according to the plan.
2: Thermal conductivity gap filler has high thermal conductivity, which can greatly improve the heat dissipation function.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certifications, with all products going through UL, SGS, RoHS certification.
AOK designs, develops and manufactures Thermal Interface Materials for industry leaders around the globe. Our core capabilities allow AOK to provide customers with customized solutions to meet their specific application needs.
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan