Home ProductsThermal Conductive Gap Filler

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

I'm Online Chat Now

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing
Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Large Image :  Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TM
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing

Description
Product Name: Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing Composition: Ceramic Filler + Silicone
Breakdown Voltage: ≥5.0(kv/mm) Dielectric Constant: 7.3(@10mhz)
Flammability: V-0 Thermal Conductivity: 3.0(W/m.K)
High Light:

Practical Thermal Conductive Gap Filler

,

LCD TVs Thermal Conductive Gap Filler

,

Multiscene Thermally Conductive Gap Filler

Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing

 

Thermal conductivity gap filler series products are a two-component preformed thermal conductive silicone grease products, which mainly meet the requirements of low pressure and high compression modulus when the products are used. They can realize automatic production, have good contact with electronic products during assembly, and show low contact thermal resistance and good electrical and pneumatic insulation characteristics. This material has some advantages of both thermal conductive gasket and thermal conductive silicone grease, which makes up for their weaknesses.

 

Thermal conductivity gap filler inherits the advantages of silica gel material, such as good affinity, weather resistance, high and low temperature resistance, and good insulation. At the same time, it has strong plasticity and can meet the filling of uneven interfaces, and can meet the heat transfer needs of various applications. It has high thermal conductivity, low-pressure compression application, low pressure, high compression ratio, high electrical insulation, good temperature resistance, and can be used automatically.

 

TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
Product features:One-part dispensable gap filler, Thermal conductivity: 1.0-6.0 W/m.k
Typical applications:Consumer Electronics: Gaming Systems, LCD TVs, Displays

 

Product feature
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators

 

Purchasing information
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail

 

Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic

 

Storage & Shelf life

Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.

 

Practical Thermal Conductive Gap Filler Multiscene Room Temperature Curing 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color Green Visual
Density(g/cc) 2.9 ASTM D792
Extrudability(g/s) 5.0 ISO9048
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥5.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^14 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)