|Product Name:||Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing||Composition:||Ceramic Filler + Silicone|
|Breakdown Voltage:||≥5.0（kv/mm）||Dielectric Constant:||7.3（@10mhz）|
Practical Thermal Conductive Gap Filler,
LCD TVs Thermal Conductive Gap Filler,
Multiscene Thermally Conductive Gap Filler
Single Part Silicone Thermal Conductive Gap Filler With Room Temperature Curing
Thermal conductivity gap filler series products are a two-component preformed thermal conductive silicone grease products, which mainly meet the requirements of low pressure and high compression modulus when the products are used. They can realize automatic production, have good contact with electronic products during assembly, and show low contact thermal resistance and good electrical and pneumatic insulation characteristics. This material has some advantages of both thermal conductive gasket and thermal conductive silicone grease, which makes up for their weaknesses.
Thermal conductivity gap filler inherits the advantages of silica gel material, such as good affinity, weather resistance, high and low temperature resistance, and good insulation. At the same time, it has strong plasticity and can meet the filling of uneven interfaces, and can meet the heat transfer needs of various applications. It has high thermal conductivity, low-pressure compression application, low pressure, high compression ratio, high electrical insulation, good temperature resistance, and can be used automatically.
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
Product features:One-part dispensable gap filler, Thermal conductivity: 1.0-6.0 W/m.k
Typical applications:Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan