|Composition:||Ceramic Filler + Silicone||Color:||Green|
|Usage Temperature:||-40~150（℃）||Thermal Resistance:||0.3 (℃-in2/W)0.1mm@50psi|
Electrical Thermally Conductive Gap Filler,
V-0 Thermally Conductive Gap Filler,
Multiscene Electrically Conductive Gap Filler
TM Series Thermal Conductive Gap Filler, one-part dispensable gap fillers are non-curing ceramic filled silicone materials. They are used in high tolerance applications and are present in designs requiring reduced mechanical stress. TM Series gap fillers can be dispensed manually or used in high-volume automated dispense applications.
TM Series Thermally conductive Gap Filler, available in liquid formable and curable formulations, provide low component stress, rework simplicity, process flexibility, in-application stability and efficient thermal conductivity. These heat dissipation gels are effective across industrial and automotive applications.
Thermal conductivity gap filler for Industrial Applications: Thermal conductivity gap filler are high thermal conductivity liquid formable materials that can be automatically dispensed, provide low component stresses during assembly and simplify rework processes. The highly-conformable, shear-thinning materials require no curing, no mixing or refrigeration, streamlining storage, handling and processing. The unique chemistry platform delivers excellent thermal performance, low applied stress and reliable long-term performance. Thixotropic with a natural tack, materials conform to the component and remain in place within the application.
■ Thermal conductivity: 1.0-6.0 W/m.k
■ No cure required
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
Packing specification: 300ml Cartridge/ 1Kg Jar/20KG Pail
Directions for use
• Stir prior to use
• Application surface should be clean and free of dust, dirt or oils.
• When using material from jar or pail, the container should be sealed and closed immediately after usage to prevent foreign material contamination.
• Follow storage instruction for unused material.
• Application bond line should not exceed 6mm.
• Avoid contact with the eyes.
• Product is nontoxic
Storage & Shelf life
Store in a cool, dry, well-ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Breakdown Voltage(kv/mm)||≥5.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^14||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
Contact Person: Jason Zhan