|Product Name:||1.0w/M.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant||Usage Temperature:||-40~150（℃）|
RoHS Thermally Conductive Encapsulant,
0.8W/MK Thermally Conductive Encapsulant,
Multipurpose Thermally Conductive Epoxy Potting Compound
1.0w/M.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant
The high-voltage power pack is an electronic component that needs to withstand more than 100000 volts. It usually works under the harsh environment of high temperature, high humidity and high salt fog all the year round. Therefore, the circuit board of the high-voltage power pack is easier to be corroded than the ordinary circuit board. Ordinary circuit boards will be coated with three proofing paints to protect themselves from corrosion in the natural environment, but this method is not applicable to high-voltage power supply groups. As the coating formed by the three proofing paints is very thin, usually only about 20mm~200mm, the mechanical impact resistance and moisture penetration resistance are very weak, so it is difficult to meet the protection requirements of high-voltage power supply groups.
The high-voltage power supply is an electronic module with very high calorific value. Most partners usually inject a layer of power potting adhesive into the high-voltage power supply. Therefore, the power potting adhesive can be used as a heat conducting medium to transfer the heat generated by the heat source to the heat dissipation shell with high efficiency, and then effectively increase the heat dissipation ability of the high-voltage power supply.
Thermally Conductive Encapsulant is suitable for a wide range of environments with temperature and humidity changes. It has good reliability, strong shock resistance and good fall resistance. What is important is that the physical and chemical properties of the power supply thermally conductive encapsulant are loved by many people. In various greenhouse environments, it will be flexible, and will not release heat in the process of atomization. It has good restorability, and can be quickly applied to electronic and electrical products, high-frequency transformers, connectors, sensors, circuit boards and other places.
Good thermal conductivity; Good insulation performance, smooth surface and low shrinkage; Low viscosity, easy gas emission; Good solvent resistance and waterproof performance; Fire resistance grade UL94 V-0; Long working hours; Excellent thermal shock resistance.
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Sliver Grey||Visual|
|Breakdown Voltage(kv/mm)||≥10.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.5||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^15||ASTM D257|
|Thermal conductivity(W/m.K)||0.8||ASTM D5470|
|Viscosity/Component A (cps)||4500||ASTM D2196|
|Viscosity/Component B (cps)||4500||ASTM D2196|
|Hradness,after cure(shore OO)||60||ASTM D22240|
|Working Time@25℃(min)||30||ISO 9048|
Contact Person: Jason Zhan