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Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD

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Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD

Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD
Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD

Large Image :  Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: GF
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD

Description
Product Name: Gap Filler Silicon Thermal Potting Glue Thermally Conductive Encapsulant For LED/LCD Composition: Ceramic Filler + Silicone
Thermal Resistance: 0.15 (℃-in2/W)0.1mm@50psi Dielectric Constant: 5.5(@10mhz)
Hardness, After Cure: 60(shore Oo) Working Time@25℃: 30(min)
High Light:

Anti Insulation Thermally Conductive Encapsulant

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LCD Thermally Conductive Encapsulant

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Flame Retardant LED Potting Compound

Gap Filler Silicon Thermal Potting Glue Thermally Conductive Encapsulant For LED/LCD

 

GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration. It can be used for a long time from minus 60 ℃ to above 200 ℃. With the change of temperature, it is still elastic and will not crack. And good heat conduction and heat dissipation, extending the service life of electronic products.

 

Thermally Conductive Encapsulant is a low viscosity flame retardant two-component addition molded silicone thermal conductive potting adhesive, which can be cured at room temperature or by heating. The higher the temperature, the faster the curing. It is made by adding heat conducting material on the basis of ordinary potting silica gel or bonding silica gel. Generally, it is made by excellent manufacturers: it will not produce any by-products in the curing reaction, and can be applied to the surface of PC (poly carbon), PP, ABS, PVC and other materials and metals. It is applicable to heat conduction, insulation, waterproof and flame retardance of electronic accessories, and its flame retardancy shall reach ul94-v0. Comply with EU ROHS directive. The main application fields are the potting of electronic and electrical components and electrical components, as well as the potting of similar temperature sensors.

 

 

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

 

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

 

 

Purchasing Information

Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

 

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes

 

Storage

Store in a cool, dry, well-ventilated place.

 

Shelf life

Shelf life of the product is 12 months after date of shipment.

 

Anti Insulation Thermally Conductive Encapsulant Flame Retardant For LED LCD 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Sliver Grey Visual
Density(g/cc) 1.8 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥10.0 ASTM D149
Dielectric Constant(@10mhz) 5.5 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^15 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 0.8 ASTM D5470
Viscosity/Component A (cps) 4500 ASTM D2196
Viscosity/Component B (cps) 4500 ASTM D2196
Hradness,after cure(shore OO) 60 ASTM D22240
Working Time@25℃(min) 30 ISO 9048

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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