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RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

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RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose
RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

Large Image :  RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: GF
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200ml each part)
Packaging Details: 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Delivery Time: 13-15 working days
Payment Terms: T/T

RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose

Description
Product Name: 1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant Usage Temperature: -40 ℃ ~ 150 ℃
Composition: Silicone Dielectric Constant: 5.5(@10mhz)
Flammability: V-0 Thermal Conductivity: 0.8 W/m.K
High Light:

RoHS Thermally Conductive Encapsulant

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0.8W/MK Thermally Conductive Encapsulant

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Multipurpose Thermally Conductive Epoxy Potting Compound

1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant

 

The high-voltage power pack is an electronic component that needs to withstand more than 100000 volts. It usually works under the harsh environment of high temperature, high humidity and high salt fog all the year round. Therefore, the circuit board of the high-voltage power pack is easier to be corroded than the ordinary circuit board. Ordinary circuit boards will be coated with three proofing paints to protect themselves from corrosion in the natural environment, but this method is not applicable to high-voltage power supply groups. As the coating formed by the three proofing paints is very thin, usually only about 20mm~200mm, the mechanical impact resistance and moisture penetration resistance are very weak, so it is difficult to meet the protection requirements of high-voltage power supply groups.

 

The high-voltage power supply is an electronic module with very high calorific value. Most partners usually inject a layer of power potting adhesive into the high-voltage power supply. Therefore, the power potting adhesive can be used as a heat conducting medium to transfer the heat generated by the heat source to the heat dissipation shell with high efficiency, and then effectively increase the heat dissipation ability of the high-voltage power supply.

 

Thermally Conductive Encapsulant is suitable for a wide range of environments with temperature and humidity changes. It has good reliability, strong shock resistance and good fall resistance. What is important is that the physical and chemical properties of the power supply thermally conductive encapsulant are loved by many people. In various greenhouse environments, it will be flexible, and will not release heat in the process of atomization. It has good restorability, and can be quickly applied to electronic and electrical products, high-frequency transformers, connectors, sensors, circuit boards and other places.

 

Good thermal conductivity; Good insulation performance, smooth surface and low shrinkage; Low viscosity, easy gas emission; Good solvent resistance and waterproof performance; Fire resistance grade UL94 V-0; Long working hours; Excellent thermal shock resistance.

 

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time

 

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

 

 

Purchasing Information

Packing specification: 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)

 

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25
C: 4 hours
• Full cure @ 100
C: 5 minutes

 

Storage

Store in a cool, dry, well-ventilated place.

 

Shelf life

Shelf life of the product is 12 months after date of shipment.

 

RoHS Certification 0.8W/m.K Thermal Conductive Gap Filler Potting Compound Multipurpose 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Sliver Grey Visual
Density(g/cc) 1.8 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥10.0 ASTM D149
Dielectric Constant(@10mhz) 5.5 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^15 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 0.8 ASTM D5470
Viscosity/Component A (cps) 4500 ASTM D2196
Viscosity/Component B (cps) 4500 ASTM D2196
Hradness,after cure(shore OO) 60 ASTM D22240
Working Time@25℃(min) 30 ISO 9048

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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