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White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

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White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound
White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

Large Image :  White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: GF
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200mL each part)
Packaging Details: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Delivery Time: 13-15working days
Payment Terms: T/T

White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound

Description
Product Name: Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells Color: White
Density: 1.8(g/cc) Viscosity/Component A: 4500(cps)
Viscosity/Component B: 4500(cps) Working Time@25℃: 30(min)
High Light:

White Thermal Conductive Encapsulant

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Heatproof Thermal Conductive Encapsulant

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Heatproof Silicone Potting Compound

Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells

 

GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration. It can be used for a long time from minus 60 ℃ to above 200 ℃. With the change of temperature, it is still elastic and will not crack. And good heat conduction and heat dissipation, extending the service life of electronic products.

 

 

Thermally Conductive Encapsulant is a newly soft insulating material of adhesive compounds. It cures with no heat, no corrosion and little shrinkage. It can be applied to the sealing and pouring of various electronic components, and then forming insulation system. It is suitable for bonded seal of electronic components, power module and control module, which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

 

Thermally Conductive Encapsulant is a two-component condensation thermal conductive potting adhesive, which can reliably protect sensitive circuits and components for a long time within a wide range of temperature and humidity changes. It has excellent electrical insulation performance, can withstand environmental pollution, and avoid damage to products due to environmental factors such as stress, vibration and humidity. It is especially suitable for products requiring good heat dissipation for potting materials. The product has excellent physical and chemical resistance. After 1:1 mixing, it can be cured at room temperature or heated quickly, with minimal shrinkage, no heat release during the curing process, no solvent or curing by-products, repairable, and can be deeply cured into elastomer.

 

 

 

Product feature
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
Pls put part A and part B in separate container and stir evenly before mixing the two part together.

 

Typical applications
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications

 

 

Purchasing Information

Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)

 

Directions for use

• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes

 

Storage

Store in a cool, dry, well-ventilated place.

 

Shelf life

Shelf life of the product is 12 months after date of shipment.

 

White Heatproof Thermal Conductive Encapsulant ,Silicone Potting Compound 0

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Sliver Grey Visual
Density(g/cc) 1.8 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥10.0 ASTM D149
Dielectric Constant(@10mhz) 5.5 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^15 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 0.8 ASTM D5470
Viscosity/Component A (cps) 4500 ASTM D2196
Viscosity/Component B (cps) 4500 ASTM D2196
Hradness,after cure(shore OO) 60 ASTM D22240
Working Time@25℃(min) 30 ISO 9048

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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