|Product Name:||Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells||Color:||White|
|Viscosity/Component B:||4500(cps)||Working Time@25℃:||30(min)|
White Thermal Conductive Encapsulant,
Heatproof Thermal Conductive Encapsulant,
Heatproof Silicone Potting Compound
Thermally Conductive Encapsulant Transparent Silicone Encapsulant For Solar Cells
GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration. It can be used for a long time from minus 60 ℃ to above 200 ℃. With the change of temperature, it is still elastic and will not crack. And good heat conduction and heat dissipation, extending the service life of electronic products.
Thermally Conductive Encapsulant is a newly soft insulating material of adhesive compounds. It cures with no heat, no corrosion and little shrinkage. It can be applied to the sealing and pouring of various electronic components, and then forming insulation system. It is suitable for bonded seal of electronic components, power module and control module, which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.
Thermally Conductive Encapsulant is a two-component condensation thermal conductive potting adhesive, which can reliably protect sensitive circuits and components for a long time within a wide range of temperature and humidity changes. It has excellent electrical insulation performance, can withstand environmental pollution, and avoid damage to products due to environmental factors such as stress, vibration and humidity. It is especially suitable for products requiring good heat dissipation for potting materials. The product has excellent physical and chemical resistance. After 1:1 mixing, it can be cured at room temperature or heated quickly, with minimal shrinkage, no heat release during the curing process, no solvent or curing by-products, repairable, and can be deeply cured into elastomer.
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Pls put part A and part B in separate container and stir evenly before mixing the two part together.
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Sliver Grey||Visual|
|Breakdown Voltage(kv/mm)||≥10.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.5||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^15||ASTM D257|
|Thermal conductivity(W/m.K)||0.8||ASTM D5470|
|Viscosity/Component A (cps)||4500||ASTM D2196|
|Viscosity/Component B (cps)||4500||ASTM D2196|
|Hradness,after cure(shore OO)||60||ASTM D22240|
|Working Time@25℃(min)||30||ISO 9048|
Contact Person: Jason Zhan