|Product Name:||White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer||Composition:||Silicone|
|Breakdown Voltage:||≥10（kv/mm）||Usage Temperature:||-40~150（℃）|
Heatproof Thermally Conductive Potting Compound,
Electronics Thermally Conductive Potting Compound,
UL Potting Compound For Electronics
White Thermal Conductivity Silicone Encapsulating Low Viscosity For Transformer
GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration.
Thermal Conductivity Silicone Encapsulating is more and more widely used in various transformer fields. More Thermal Conductivity Silicone Encapsulating can be applied to the pouring, potting and sealing of large transformer coils, the plugging of oil type transformer trachoma and the potting of small transformer components. The requirements for thermal conductive epoxy resin sealant for transformers are becoming more and more strict. According to different types of transformers, it is necessary to consider a specific requirement for transformers and better use of glue.
According to the different objects used, there are also requirements for the performance of Thermal Conductivity Silicone Encapsulating. For example, some require quick drying at low temperature, and some require excellent insulation performance. Therefore, the epoxy resin can be better used in the product only after it is modified. It has high temperature resistance, excellent electrical insulation, high hardness, stability and chemical resistance. The epoxy resin potting adhesive, which is not suitable for alkali, salt and other impurities, is not easy to deteriorate and has long service life.
Precautions for use: the glue taking tools must not be mixed, and the glue must be sealed in time; If the glue touches the skin, wash it with soap and water in time; Pay attention to ventilation in the operating environment. The unused glue should be covered and placed in a cool and ventilated place.
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Sliver Grey||Visual|
|Breakdown Voltage(kv/mm)||≥10.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.5||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^15||ASTM D257|
|Thermal conductivity(W/m.K)||0.8||ASTM D5470|
|Viscosity/Component A (cps)||4500||ASTM D2196|
|Viscosity/Component B (cps)||4500||ASTM D2196|
|Hradness,after cure(shore OO)||60||ASTM D22240|
|Working Time@25℃(min)||30||ISO 9048|
Contact Person: Jason Zhan