|Product Name:||Ultra Soft Low Resistance 1.0W Thermal Conductivity Silicon Thermal Pad||Composition:||Silicon|
Ultrasoft PC Thermal Pad,
Heatproof PC Thermal Pad,
1W Gap Pad Thermal Conductivity
Utp100 series Ultra Soft thermal pad is processed by special process using silica gel and thermal conductive ceramic filler and glass fiber cloth as reinforcement material. The product has the characteristics of softness, tensile resistance and tear resistance, and has good compression and resilience. It can effectively fill the gap between devices to achieve heat dissipation effect and reduce the process requirements of heat dissipation structure. It can adapt to the changes of temperature and pressure and can be used stably for a long time. It is suitable for the heat dissipation design of automotive batteries.
The thermal conductivity is 1.0w/m · K, which can be prefabricated and easy to use.
It does not corrode metal devices, is safe and non-toxic, complies with EU ROHS standards, and the flame retardant grade can reach UL94 V-0.
High electrical insulation, breakdown voltage can reach above 6kV. Effectively prevent damage caused by short circuit of electronic components.
Soft, good resilience, can effectively fill gaps, high compression performance, can meet different design requirements, up to 50%. Low stress, can effectively prevent damage caused by extrusion, and better protect electronic components.
High and low temperature resistance, oxidation resistance, can meet the use requirements under severe conditions, good stability, and can be used continuously for a long time.
The product is self-adhesive on one side, without additional adhesive, easy to assemble, without displacement during construction, and can be arbitrarily cut according to the needs of customers.
Glass fiber cloth is used as reinforcing material to prevent puncture, so that it has high tensile strength and tear strength.
The product has certain toughness and will not be damaged due to the fastening force during assembly. It can keep the performance for long-term use in harsh environments, meet the design purposes of insulation, heat conduction, jointing, sealing, filling gaps, shock absorption, sound absorption, etc., and reduce the assembly cost and improve the manufacturing efficiency.
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
|Composition||Ceramic Filler, Silicone, and Reinforced Fiberglass||-|
|Color||White and Brick Red||Visual|
|Hardness(shore oo)||30±5||ASTM D2240|
|Tensile Strength(KN/m)||2.5||ASTM D624|
|Breakdown Voltage(kv/mm)||≥7.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.7||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^13||ASTM D257|
|Thermal conductivity(W/m.K)||1.0±0.1||ASTM D5470|
Contact Person: Jason Zhan