China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

I'm Online Chat Now

Notebook Thermal Pad

Notebook Thermal Pad
Notebook Thermal Pad Notebook Thermal Pad

Large Image :  Notebook Thermal Pad

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Notebook Thermal Pad

Product Name: Ultra Soft Thermal Pad With 1.0w Thermal Conductive Gasket Of Battery Pack Composition: Silicone And Reinforced Fiberglass
Thermal Conductivity(W/m.K): 1.0 Thickness: 0.5~12.0 (mm)
Dielectric Constant(@10mhz): 5.7 Hardness: 30±5(Shore OO)
High Light:

pcb thermal pad


Notebook Thermal Pad


Silicone Thermal Pad

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.k thermal conductivity

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470


Product feature:
■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
thermal silicone sheet with shock absorption and sound absorption effect;
■ High breakdown voltage
The main purpose of the thermal conductive silica gel piece is to reduce the thermal resistance generated between the heat source surface and the contact surface of the heat dissipation device. The thermal conductive silica gel piece can fill the gap of the contact surface well.
■ Elongation 60%


Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs


Purchase information:



Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm


Notebook Thermal Pad 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)