|Product Name:||Ultra Soft Thermal Pad||Color:||White And Brick Red|
|Composition:||Ceramic Filler, Silicone, And Reinforced Fiberglass||Thickness:||0.5~12.0 (mm)|
Tear Resistant Soft Thermal Pads,
Laptop Soft Thermal Pads,
Antiwear Heat Sink Pad For Laptop
Ultra Soft Thermal Pad low permeability oil gap filler with 1.0w is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side . This combination allows for high breakdown voltage and cut through resistance, while providing the desirable low contact resistance and tolerance pickup of gap filling pads . UTP 100 versatility lends itself to a multitude of designs.
UTP series products are made by using silica gel and thermal conductive ceramic filler, adding glass fiber cloth as reinforcement material, and processed by special technology. With single-sided self-adhesive type, anti puncture and high breakdown voltage, it is a very soft thermal pad with excellent compressibility. It can be in close contact with electronic components, effectively reduce the interface resistance, and has excellent thermal conductivity.
As a kind of flexible heat conducting material, UTP series is widely used in the gap filling between heating elements and radiating elements. In addition to the role of interface heat transfer, it can also play the role of insulation, shock absorption and buffer, absorption tolerance and so on.
Product features:Thermal Conductivity:1.0W/mK,Ultra Soft, Reinforced Gap Filler Pad, low permeability oil
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Thermal Conductivity:1.0 W/ mK
■ Ultra soft and highly compliant
■ the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ The main purpose of the thermal conductive silica gel piece is to reduce the thermal resistance generated between the heat source surface and the contact surface of the heat dissipation device. The thermal conductive silica gel piece can fill the gap of the contact surface well.
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
|Composition||Ceramic Filler, Silicone, and Reinforced Fiberglass||-|
|Color||White and Brick Red||Visual|
|Hardness(shore oo)||30±5||ASTM D2240|
|Tensile Strength(KN/m)||2.5||ASTM D624|
|Breakdown Voltage(kv/mm)||≥7.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.7||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^13||ASTM D257|
|Thermal conductivity(W/m.K)||1.0±0.1||ASTM D5470|
Contact Person: Jason Zhan