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RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer

RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer
RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer

Large Image :  RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Packaging Details: 400 mm x 200 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer

Description
Product Name: 5 Mm Ultra Soft 60% Elongation1 W/m.K Thermal Silicone Pad For Computer Flammability: V-0
Thermal Conductivity: 1.0±0.1 W/m.K Composition: Ceramic Filler, Silicone, And Reinforced Fiberglass
Elongation: 60% Thickness: 0.5~12.0 Mm
High Light:

RoHS Ultra Soft Thermal Pad

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1W/MK Ultra Soft Heating Pad

 

5 mm Ultra Soft 60% Elongation 1 W/m.K Thermal Silicone Pad For Computer

 

With the development of information technology, big data and cloud computing are gradually entering people's lives. As the node of the network, the computer server stores and processes 80% of the data and information on the network, which is similar to the general computer chassis, including processor, hard disk, memory, system bus, etc.

 

The demand for multi-media streaming, cloud storage, data mining, analysis and machine learning applications drives the demand for high-performance computing solutions, thereby increasing the number of CPU and GPU in the server to improve the processor speed. Due to the limited volume of the server, many high-power electronic components operate for a long time and under high load. Whether the heat generated by the electronic components can be transferred to the outside in time is directly related to the stability of the server. Computer service cooling usually requires a combination of several cooling methods. In addition to active cooling such as air cooling and water cooling, advanced thermal management materials and Ultra Soft Thermal Pad are also required in the cooling scheme to help realize a connected and fast cooling path.

 

Ultra Soft Thermal Pad characteristics: good thermal conductivity; With self-adhesive without additional surface adhesive; High compressibility, soft and elastic, suitable for low pressure applications; Various thickness options are available.

 

Product feature:
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ pink pad
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN/m
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

RoHS Self Adhesive Ultra Soft Thermal Pad 1 W/m.K For Computer 1

 

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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