|Product Name:||0.25mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad||Composition:||Silicone + Fiberglass Carrier|
Nontoxic Thermally Conductive Interface Pads,
Antiwear Thermally Conductive Interface Pads,
Heatproof Thermal Pad Electronics
0.25mm Thickness Thermal Insulation Pad For Power Supplies With Yellow Fiberglass Carrier Pad
TC 1500B is a heat cure, low thermal resistance tape. This double-layer low-modules silicone provides low contact resistance and superior adhesion designed to absorb assemble and application shock and vibrations. This unique blend of modulus and strength also reduces application stress due to CTE mismatch.
Product features:High Performance Insulating Tape
Typical applications:Used to bond independent packaged semiconductors and heat sinks
Thermal Insulation Pad is a kind of high-performance Elastomer Insulation Material Based on special film. It has excellent cutting resistance and excellent thermal conductivity, and is widely used in electronic and electrical industries.
Thermal Insulation Pad has both heat conducting function and insulation function. Different from thermall pad, the thermal insulation pad can withstand higher breakdown voltage under the condition of limited thickness. Therefore, it is widely used in MOS power tubes and other applications requiring heat conducting insulation. Thermal Insulation Pad is also called heat conductive silicon tape. As a manufacturer of heat conductive silicon tape, AOK will tell you how to select the correct thermal insulation pad.
The main purpose of using thermal insulation pad is to reduce the thermal resistance between the heat source surface and the radiator contact surface, including the interface contact thermal resistance. The thermal insulation pad can well fill the air gap of the contact interface and squeeze the air out of the contact surface. Air is a poor conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces. With the supplement of thermal insulation pad, the contact surface can be in better and full contact, so as to truly achieve face-to-face contact, and the temperature response can achieve the minimum temperature difference.
■ 1.4 W/mK
■ Heat cure at 160C
■ Low thermal resistance
■ Electrically insulating
■ High shear strength
■ -40 to 200C use temperature
■ Networking and Telecommunications
■ Industrial: Power Supplies
■ Automotive: Power Modules, Inverters, LED
■ Consumer Electronics: Power Supplies, AC/DC Converting
|Composition||Silicone + Fiberglass Carrier||-|
|Shear Strength(MPa)@RT||1.4||ASTM D1002|
|Breakdown Voltage(kv/mm)||＞ 4.5||ASTM D149|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Dielectric Constant(@1MHz)||5||ASTM D150|
|Thermal conductivity(W/m.K)||1.4||ASTM D5470|
Contact Person: Jason Zhan