|Product Name:||1.4w/M.K Thermal Conductivity High Performance Insulation Pad Yellow Silicone Thermal Sheet||Composition:||Silicone + Fiberglass Carrier|
|Breakdown Voltage:||≥4.5（kv/mm）||Tensile Strength:||＞20（kn/m）|
Nontoxic Thermally Conductive Interface Pads,
Antiwear Thermally Conductive Interface Pads,
Heatproof Thermal Pad Electronics
1.4w/M.K Thermal Conductivity High Performance Insulation Pad Yellow Silicone Thermal Sheet
TC 1500B is a heat cure, low thermal resistance tape. This double-layer low-modules silicone provides low contact resistance and superior adhesion designed to absorb assemble and application shock and vibrations. This unique blend of modulus and strength also reduces application stress due to CTE mismatch. Thermal Pad is mainly used in more application scenarios: traditional filling in moving, wearable and mobility devices; and it also can apply in electronic products housing for Heat conduction, Insulation, dust-proof and waterproof function.
Thermal Insulation Pad thermal conductivity products are soft, conformable thermal pads that improve heat dissipation in a range of electronic assemblies. They minimize thermal resistance from the external package of a power semiconductor to the heat sink, electrically isolating the semiconductor from the heat sink and providing sufficient dielectric strength to withstand high voltage. Designed to maximize thermal performance, they are also strong enough to resist puncture from the facing metal surface. Supplied in rolls, Thermal Insulation Pad materials are also applicable to a fully automated pick-and-place process.
Thermal Gap Pad is designed to be used in applications that require minimum amount of pressure on components and high thermal conductivity. thermal gap pad is very conformable, based in silicone rubber material and has 3.0W/mK thermal conductivity. It is easy to fill in air gaps between PC board and heat sinks or metal chassis.
Our unique silicone chemistry ensures high compliance to surface irregularity and good surface wetting property, thus offering very low Thermal Contact Resistance at Thermal Joint, and very efficient heat transfer between hot spots and heat sink.
■ High thermal interface performance:1.4 W/mK
■ High applicability: stable performance under -50~150℃
■ Excellent flame retardant performance: meet UL94-V0 level
■ Electrically insulating
■ High shear strength
■ -40 to 200C use temperature
■ Networking and Telecommunications
■ Industrial: Power Supplies
■ Automotive: Power Modules, Inverters, LED
■ Consumer Electronics: Power Supplies, AC/DC Converting
|Composition||Silicone + Fiberglass Carrier||-|
|Shear Strength(MPa)@RT||1.4||ASTM D1002|
|Breakdown Voltage(kv/mm)||＞ 4.5||ASTM D149|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Dielectric Constant(@1MHz)||5||ASTM D150|
|Thermal conductivity(W/m.K)||1.4||ASTM D5470|
Contact Person: Jason Zhan