|Product Name:||2w/Mk Green Silicone Free Thermal Pad For Server Cooling With 45 Hardness||Composition:||Acrylate|
|Hardness:||45±5(Shore OO)||Thermal Conductivity:||2.0±0.1（W/m.K）|
Ultrasoft Thermal Heat Pads,
Multiscene Thermal Heat Pads,
Anti Interfere Thermal Pad Electronics
2w/Mk Green Silicone Free Thermal Pad For Server Cooling With 45 Hardness
Certain applications require the cleanliness that only a silicone free gap filler can provide. When need arises, TP SF Series has you covered. With two options TP 200SF and TP 300SF providing 2.0W/mK and 3.0W/mK thermal conductivity, TP SF Series has it covered.
Product features:Silicone Free Gap Filler Pad,2.0 and 3.0 W/mK options.
Typical applications:Silicon Sensitive Components, Fiber Optics
Shenzhen Aochuan Technology Co., Ltd. was founded in 2004, headquartered in Shenzhen Mission Hills. Aochuan Technology is committed to becoming the world's leading supplier of thermal materials and solutions. The company possesses the ISO9001, ISO14001, IATF16949 quality management system certifications, with all products going through UL, SGS, RoHS certification.
AOK designs, develops and manufactures Thermal Interface Materials for industry leaders around the globe. Our core capabilities allow AOK to provide customers with customized solutions to meet their specific application needs.
The Silicone Free Thermal Pad has no siloxane component, no pollution, no volatilization, and does not affect the product performance. It is bound to become the development trend of thermal conductive materials in the future. Especially in Europe, the supervision on the use of electronic raw materials is becoming more and more strict, and the non silicon materials will be more widely used in Europe.
The Silicone Free Thermal Pad is applied without stress. It is the most advanced thermal conductive material at present. It has excellent thermal conductivity: the thermal conductivity is up to 3.0w, the ultra-thin interface thickness is up to 0.05mm, and the thermal resistance is very low; Good power characteristics: good insulation, breakdown voltage up to 10kV; High deformation is applicable to a variety of irregular surfaces; No silica gel, no volatilization, will not affect the performance of the product, and is conducive to optimal design. The Silicone Free Thermal Pad itself does not contain solvent and will not affect the packaging, making transportation and storage more convenient.
■ Thermal conductivity: 2.0,3.0W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
|Hardness(shore oo)||45±5||ASTM D2240|
|Breakdown Voltage(kv/mm)||≥6.0||ASTM D149|
|Thermal conductivity(W/m.K)||2.0||ASTM D5470|
Contact Person: Jason Zhan