|Product Name:||10.0mm Thickness Silicone Free Thermal Pad For Power Supplies With Green||Color:||Green|
|Thickness:||1.0~10.0 (mm)||Usage Temperature:||-40~150（℃）|
|Breakdown Voltage:||≥6.0（kv/mm）||Thermal Conductivity:||2.0±0.1（W/m.K）|
AOK Silicone Free Thermal Pad,
Computer Silicone Free Thermal Pad,
10mm Computer Heat Pad
10.0mm Thickness Silicone Free Thermal Pad For Power Supplies With Green
Certain applications require the cleanliness that only a silicone free gap filler can provide. When need arises, TP SF Series has you covered. With two options TP 200SF and TP 300SF providing 2.0W/mK and 3.0W/mK thermal conductivity, TP SF Series has it covered.
Product features: Silicone Free Gap Filler Pad,2.0 and 3.0 W/mK options.
Typical applications: Silicon Sensitive Components, Fiber Optics
Silicone Free Thermal Pad are suitable for silicon sensitive equipment with high deformation, which can be used to increase effective contact at uneven interfaces. Thirdly, glass fiber reinforcement is suitable for manual construction. The heat conducting gasket has large deformation, that is, it has low hardness and is relatively soft. The effective contact area between the interface and the heat conducting gasket can be increased without too much pressure. The non silicon material is a little harder than the traditional silica gel material. The hardness of TP-SF Silicone Free Thermal Pad has been greatly increased. The hardness is only shore00 40-50. The softer material is applied more closely, which can eliminate the air in the gap, reduce the contact thermal resistance and improve the heat conduction effect.
It is recommended not to choose Silicone Free Thermal Pad TP-SF with glass fiber as much as possible. For example, TP-SF does not have glass fiber cloth, which is more conducive to heat conduction. Moreover, the non silicon thermal conductive gasket has certain toughness and will not bring inconvenience to construction.
1. strict source control of raw materials, fully automated assembly line, no human error, standard quality control of the whole process, ensuring product consistency, and implementing the system requirements of iatf16949.
2. the product has been tested and verified by the customer for a long time, supported by the original accelerated aging test, and its stability and reliability are guaranteed.
■ Thermal conductivity: 2.0,3.0W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
|Hardness(shore oo)||45±5||ASTM D2240|
|Breakdown Voltage(kv/mm)||≥6.0||ASTM D149|
|Thermal conductivity(W/m.K)||2.0||ASTM D5470|
Contact Person: Jason Zhan