|Product Name:||2.0 W/M.K Die Cutting 45 Shore OO Hardness Silicon Free Thermal Pad||Composition:||Acrylate|
|Hardness:||45 Shore OO||Thermal Conductivity:||2.0 W/m.K|
RoHS Non Silicone Thermal Pad,
Heatproof Non Silicone Thermal Pad,
Telecommunication Heat Dissipation Pad
2.0 W/M.K Die Cutting 45 Shore OO Hardness Silicon Free Thermal Pad
Certain applications require the cleanliness that only a silicone free gap filler can provide. When need arises, TP SF Series has you covered. With two options TP 200SF and TP 300SF providing 2.0W/mK and 3.0W/mK thermal conductivity, TP SF Series has it covered.The thermal conductive gasket of acrylic resin system is not suitable for pressure sensitive components, which will cause damage to sensitive components.
Product features:Silicone Free Gap Filler Pad,2.0 and 3.0 W/mK options.
Typical applications:Silicon Sensitive Components, Fiber Optics
As a new heat conducting material in recent years, silicon free thermal pad has been popularized slowly, and it is only applied sporadically in some special equipment. It is still a long way from wide application.
The silicon free thermal pad is made of polyolefin as carrier and filled with heat conducting powder. Polyolefin has the characteristics of low density, chemical resistance, good mechanical strength and electrical insulation. Compared with the traditional thermal pad, the silicon free thermal pad has some significant application advantages: the silicon free thermal pad does not contain silicone oil, and there is no volatilization of siloxane. In some equipment with special requirements, silicon free thermal pad is a good choice. For example, for accurate laser equipment, the volatilization of siloxane will affect the internal components or laser probes, which will adversely affect the accuracy of the equipment; In addition, for cameras with optical windows, siloxane volatilizes and attaches to the lens to affect the imaging effect; LED lights are common. The atomization phenomenon usually seen is basically caused by volatiles.
■ Thermal conductivity:2.0,3.0W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.
■ No siloxane volatilization
■ High thermal conductivity
■ High insulation
■ High compressibility
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
■ Hard disk
■ Optical precision equipment
■ Notebook computer, projector and OA office electronic products
■ Mobile and communication equipment, high-speed mass
■ Storage drives, heat pipe assemblies, automotive engine control equipment
■ Telecommunication hardware and equipment, high-end industrial control and medical electronics
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
|Hardness(shore oo)||45±5||ASTM D2240|
|Breakdown Voltage(kv/mm)||≥6.0||ASTM D149|
|Thermal conductivity(W/m.K)||2.0||ASTM D5470|
Contact Person: Jason Zhan