|Product Name:||Thermal Conductive Pad With 1.5w High Cut Through Resistance Low Volatility Gap Filler||Breakdown Voltage(Kv/mm):||≥7.0|
|Usage Temperature(℃):||-40~150||Density:||2.5 (g/cc)|
|Volume Resistivity(Ω.cm):||10^13||Hardness:||40±5 (Shore OO)|
Silicone Heat Conductive Pad,
Ultrasoft Heat Conductive Pad,
Solid Thermal Pad High Conductivity
TP150 Thermal Conductive Pad is a 1.5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. TP150 is well suited for high performance in low-stress applications. And it maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness or topography. Naturally tacky, it requires no additional adhesive coating to inhibit thermal performance.
Thermal pad is a typical thermal interface material that effectively transmits heat generated from heat sources inside various devices such as electronic devices and automobiles. It is a silicone based product with excellent heat resistance and electrical insulation properties. The operating temperature of this product is from -45 to 200 degree with excellent thermal performance and compliance, which can meet the customer needs.
TP150 silicone rubber thermal gap filler is a kind of silicon rubber-based gap filling material which is highly compressed withhigh heat-conducting filling materials. The coefficient of heat conductivity can reach 1.50 W/m.K. This kind of materials is aiming at offering superb heat-conducting property and maintains the cost efficiency of customers as well. The self-adhesion of TP150 enables them to stick on heating interfaces without back adhesives or binders. Apply TP150 heat-conducting silica sheets with appropriate thickness to the gaps between heating interfaces and their components according to the different sizes of the heating interfaces and gaps to form seamless connections between the heating interfaces and related components.
"Thermal pad" is a thermal conductive medium material synthesized by special process with silica gel as the base material and metal oxide and other auxiliary materials. In the industry, it is also known as thermal conductive silica gel pad, thermal silicon film, soft thermal conductive pad, thermal conductive silica gel pad and so on. thermal pad are used for filling the two contact surfaces.They are ultra soft and have good resilience,so effectively exclude air from the contact interface. The products are naturally tacky,can be die-cut into various shapes,easy to operate. Our products have passed 1000 hours cold and hot shock test,1000 hours double 85 test,1000 hours high temperature aging test,Committed to providing more reliable heat conduction solutions for automobile, communication, security and other industries.
■ Solid, soft and flexible, have high and low viscosity type
■ Good insulation, withstanding high voltage and temperature
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ Excellent, high volume applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||40±5||ASTM D2240|
|Breakdown Voltage(Kv/mm)||≥7.0||ASTM D149|
|Dielectric Constant(@1MHz)||6.66||ASTM D150|
|Volume Resistivity(Ω.cm)||10^13||ASTM D257|
|Thermal conductivity(W/m.K)||1.5±0.1||ASTM D5470|
Contact Person: Jason Zhan