|Composition:||Ceramic Filler + Silicone||Color:||Pink|
|Thickness:||0.5~12.0 Mm||Density:||2.3 G/cc|
|Hardness:||20±5 (Shore OO)||Tensile Strength:||0.4 Kn/m|
|Elongation:||52%||Usage Temperature:||-40℃ ~ 150 ℃|
|Breakdown Voltage:||≥6.5 Kv/mm||Dielectric Constant:||5.3（@10mhz）|
|Thermal Conductivity:||1.2±0.1 W/m.K||Product Name:||Low Oil Permeability Low Volatility Pink Silicone Thermal Conductive Pad For 5G|
Pink Thermal Conductive Pad,
2.3g/Cc Thermal Conductive Pad,
5G Pink Thermal Pad
Low Oil Permeability Low Volatility Pink Silicone Thermal Conductive Pad For 5G
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/m.K, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
With the rapid development of big data and 5g commercialization, 5g network will not only serve mobile phones. The characteristics of low delay make it possible for intelligent manufacturing plants, driverless, Internet of things and so on. However, the transmission capacity, transmission speed and information processing speed will be more strictly controlled than ever before.
However, 5g requires higher data transmission speed and low delay. It needs to increase the number of large-scale output and input antenna systems, high-performance processors, special integrated circuits and hardware components in the base station. High density, high heat, high integration, small size and low weight are the development direction of 5g equipment. As a result, the system design is facing more and more thermal challenges, which requires a higher level of thermal management technology capability! At present, the heat dissipation scheme of 5g base station mainly adopts the closed natural heat dissipation scheme, which transfers heat to the external environment through heat conducting interface materials. For example, TP series thermal conductive silicone pad is a thermal conductive material for communication equipment base stations, which can solve the heat dissipation problem of processors and FPGAs. It has a high thermal conductivity of 1-10W. It has the characteristics of softness, elasticity, low oil permeability and low volatility. It can provide a variety of thickness options. It is also more suitable for the compact structure of 5g base station. Its operation is simple, convenient and fast, which greatly improves the production efficiency.
Good thermal conductivity
Low volatility, low oil permeability and high thermal conductivity;
With self-adhesive without additional surface adhesive;
High compressibility, soft and elastic, suitable for low pressure applications;
At -45 ℃ ~ 200 ℃, various thickness options are available.
|Composition||Ceramic Filler + Silicone||-|
|Thickness (mm)||0.5~12.0||ASTM d374|
|Density (g/cc)||2.3||ASTM D792|
|Hardness (Shore OO)||20±5||ASTM D2240|
|Tensile Strength(kn/m)||0.4||ASTM D624|
|Elongation %||52||ASTM D412|
|Breakdown Voltage(kv/mm)||≥6.5||ASTM D149|
|Dielectric Constant(@1mhz)||5.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^12||ASTM D257|
|Thermal conductivity(W/m.K)||1.2±0.1||ASTM D5470|
Contact Person: Jason Zhan