|Product Name:||1.2W Pink Thermal Conductivity Silicone Pad For Electronic Product||Composition:||Ceramic Filler + Silicone|
|Tensile Strength:||0.4（kn/m）||Dielectric Constant:||5.3（@10mhz）|
UL Heatsink Thermal Pad,
Electronic Heatsink Thermal Pad,
1.2W Silicone Heat Transfer Pad
1.2W Pink Thermal Conductivity Silicone Pad For Electronic Product
TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications.
What are the advantages of adding thermal conductive pad to electronic products? The interior of electronic products is composed of various electronic components and electronic materials. Besides the function, the problem that electronic products pay attention to is the stability. If general electronic parts work in high temperature environment for a long time, the service life of each part will gradually decrease, and even cause damage; If the thermal conductive silica gel sheet is installed on the IC to keep its working temperature below the medium and low temperature, it can not only ensure the correct operation of the product, but also ensure that the service life will be effectively extended. The thermal resistance chain of electronic products and devices radiates heat into the air, including: PN junction - thermal resistance on the shell surface, contact thermal resistance from the shell surface to the heat sink, thermal resistance of the thermal conductive silicone pad itself, basic thermal resistance from the surface of the thermal conductive silicone pad to the air, thermal resistance from the local environment outside the thermal conductive silicone pad to the air duct outside the remote chassis. After the thermal conductive silicone pad is installed, the thermal resistance of the thermal conductive silicone pad is considered as a new addition from the surface, However, if it is not added, the shell will directly exchange heat with the air, and the thermal resistance between the two can be greatly increased. The heat dissipation area is increased by adding thermal conductive silicon pad. It can be seen that the addition of thermal conductive silicon pad greatly reduces the total thermal resistance of the heat dissipation channel, which is a great contribution and help to the heat dissipation of electronic products.
Thermal conductive silicon pad is a kind of thermal conductive medium material synthesized by special process with silica gel as the base material and various auxiliary materials such as metal oxides. The thermal conductive silicone pad is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap to complete the heat transfer between the heating part and the cooling part. At the same time, it also plays the role of insulation and vibration reduction. It can meet the design requirements of miniaturization and ultra-thin equipment. It is a very good thermal conductive interface material with engineering and usability and a wide range of thickness applications.
|Composition||Ceramic Filler + Silicone||-|
|Thickness (mm)||0.5~12.0||ASTM d374|
|Density (g/cc)||2.3||ASTM D792|
|Hardness (Shore OO)||20±5||ASTM D2240|
|Tensile Strength(kn/m)||0.4||ASTM D624|
|Elongation %||52||ASTM D412|
|Breakdown Voltage(kv/mm)||≥6.5||ASTM D149|
|Dielectric Constant(@1mhz)||5.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^12||ASTM D257|
|Thermal conductivity(W/m.K)||1.2±0.1||ASTM D5470|
Contact Person: Jason Zhan