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UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad

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UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad

UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad
UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad

Large Image :  UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad

Description
Product Name: 1.2W Pink Thermal Conductivity Silicone Pad For Electronic Product Composition: Ceramic Filler + Silicone
Thermal Conductivity: 1.2W/m.K Color: Pink
Tensile Strength: 0.4(kn/m) Dielectric Constant: 5.3(@10mhz)
High Light:

UL Heatsink Thermal Pad

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Electronic Heatsink Thermal Pad

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1.2W Silicone Heat Transfer Pad

1.2W Pink Thermal Conductivity Silicone Pad For Electronic Product

 

TP 120 is an extremely soft gap filler pad, design to be a versatile thermal workhorse. With a shore hardness of 20 (00), and thermal conductivity of 1.2 W/ mK, TP 120 will not overstress applications and provide low contact resistance even in the most varying of applications. 

 

What are the advantages of adding thermal conductive pad to electronic products? The interior of electronic products is composed of various electronic components and electronic materials. Besides the function, the problem that electronic products pay attention to is the stability. If general electronic parts work in high temperature environment for a long time, the service life of each part will gradually decrease, and even cause damage; If the thermal conductive silica gel sheet is installed on the IC to keep its working temperature below the medium and low temperature, it can not only ensure the correct operation of the product, but also ensure that the service life will be effectively extended. The thermal resistance chain of electronic products and devices radiates heat into the air, including: PN junction - thermal resistance on the shell surface, contact thermal resistance from the shell surface to the heat sink, thermal resistance of the thermal conductive silicone pad itself, basic thermal resistance from the surface of the thermal conductive silicone pad to the air, thermal resistance from the local environment outside the thermal conductive silicone pad to the air duct outside the remote chassis. After the thermal conductive silicone pad is installed, the thermal resistance of the thermal conductive silicone pad is considered as a new addition from the surface, However, if it is not added, the shell will directly exchange heat with the air, and the thermal resistance between the two can be greatly increased. The heat dissipation area is increased by adding thermal conductive silicon pad. It can be seen that the addition of thermal conductive silicon pad greatly reduces the total thermal resistance of the heat dissipation channel, which is a great contribution and help to the heat dissipation of electronic products.

 

Thermal conductive silicon pad is a kind of thermal conductive medium material synthesized by special process with silica gel as the base material and various auxiliary materials such as metal oxides. The thermal conductive silicone pad is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap to complete the heat transfer between the heating part and the cooling part. At the same time, it also plays the role of insulation and vibration reduction. It can meet the design requirements of miniaturization and ultra-thin equipment. It is a very good thermal conductive interface material with engineering and usability and a wide range of thickness applications.

 

Product feature:

  • Thermal Conductivity:1.2W/mK
  • Ultra soft and highly compliant
  • Naturally tacky, easing application
  • Low pressure versus deflection
  • Excellent, high volume applications

Typical applications:

  • Networking and Telecommunications
  • IT: Notebooks, Tablets, Power Conversion
  • Industrial: LEDs, Power Supplies and Conversion
  • Automotive: Control Modules, Turbo Actuators
  • Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

 

UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad 0

 

 

UL Electronic Heatsink Thermal Pad , 1.2W Silicone Heat Transfer Pad 1

 

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness (mm) 0.5~12.0 ASTM d374
Density (g/cc) 2.3 ASTM D792
Hardness (Shore OO) 20±5 ASTM D2240
Tensile Strength(kn/m) 0.4 ASTM D624
Elongation % 52 ASTM D412
Usage Temperature(℃) -40~150 -
Electrical    
Breakdown Voltage(kv/mm) ≥6.5 ASTM D149
Dielectric Constant(@1mhz) 5.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^12 ASTM D257
Flammability V-0 UL94
 Thermal    
Thermal conductivity(W/m.K) 1.2±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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