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-40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K

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China Shenzhen Aochuan Technology Co., Ltd certification
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The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

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-40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K

-40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K
-40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K -40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K -40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K

Large Image :  -40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP 800
Payment & Shipping Terms:
Minimum Order Quantity: 1000 pcs
Packaging Details: 300 mm x 50 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

-40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K

Description
Product Name: -40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5W/m.K Composition: Ceramic Filler + Silicone
Thermal Conductivity: 8.0±0.5 (W/m.K) Color: Pink
Breakdown Voltage: >6.0 (kv/mm) Usage Temperature: -40 ℃ ~ 150 ℃

 
-40 ℃ ~ 150 ℃ Usage Temperature Thermal Insulation Ceramic Filler + Silicone Pad With 8.0±0.5 W/m.K
 
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.

 

Thermal conductive pad product characteristics:

Good thermal conductivity
With self-adhesive without additional surface adhesive
Highly compressible, soft and elastic, suitable for low pressure applications
Available in a variety of thicknesses

 

Application of thermal conductive pad:

Radiator bottom or frame
Set top box
Power supply and vehicle storage battery
Charging point
LED TV LED lamps
RDRAM memory module
Miniature heat pipe radiator

 

AttributeValueTest Method
CompositionCeramic Filler + Silicone-
ColorPinkVisual
Thickness(mm)0.5~10astm d374
Density(g/cc)3.35ASTM D792
Hardness(shore oo)55±10ASTM D2240
Usage Temperature(℃)-40~150--
Electrical  
Breakdown Voltage(kv/mm)>6.0ASTM D149
Dielectric Constant(@10mhz)7.2ASTM D150
Volume Resistivity(Ω.cm)10^12ASTM D257
FlammabilityV-0UL94
Thermal  
Thermal conductivity(W/m.K)8.0±0.5ASTM D5470

Thermal Graphite Sheet

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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