|Product Name:||Pink Silicone High Thermal Conductive Thermal Pad Material With 8.0w For Cpu||Composition:||Silicone|
|Dielectric Constant:||7.2（@10mhz）||Volume Resistivity:||1.0*10^12（Ω.cm）|
Multipurpose Thermal Silicone Pad,
Thermal Silicone Pad Multipurpose,
Nontoxic Thermal Pad For Electronics
TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink
The Thermal Pad Material is soft, thermally conductive and insulated. In particular, it has good compressibility. Its thickness can adapt to the space range of different set-top boxes, and has good controllability. Generally speaking, if the heat energy generated by household appliances such as induction cooker, rice cooker, set-top box, microwave oven, etc. during normal operation cannot be exported in time, the junction temperature of the appliance will be too high, which will affect the product life cycle, service efficiency and stability. The relationship between the junction temperature, operation efficiency and service life of the appliance. The set-top box transfers the heat of the chip to the shell through the thermal conductive silicone sheet, and dissipates heat through natural convection, so there is no need to worry about burning the set-top box because the shell is too hot.The temperature can be reduced by about 18 ℃ by using a soft thermal conductive silica gel sheet between the main IC of the set-top box or the components with high temperature and the heat sink or the shell of the set-top box.
The Thermal Pad Material is used to fill the air gap between the heating device and the heat sink or metal base. The flexible and elastic characteristics of the thermal conductive silicone sheet enable it to be used to cover very uneven surfaces. The heat is transmitted from the separation device or the whole PCB to the metal shell or diffusion plate, which can improve the efficiency and service life of the heating electronic components. The application of thermal conductive silica gel sheet in set-top box enables it to dissipate heat faster and prolong the service life of the product.
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.
Standard size: T≤1.5mm,size=200*400mm; T＞1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||55±10||ASTM D2240|
|Breakdown Voltage(kv/mm)||＞6.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.2||ASTM D150|
|Volume Resistivity(Ω.cm)||10^12||ASTM D257|
|Thermal conductivity(W/m.K)||8.0±0.5||ASTM D5470|
Contact Person: Jason Zhan