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Ultra Soft Laptop GPU Thermal Pad

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Ultra Soft Laptop GPU Thermal Pad

Ultra Soft Laptop GPU Thermal Pad
Ultra Soft Laptop GPU Thermal Pad Ultra Soft Laptop GPU Thermal Pad

Large Image :  Ultra Soft Laptop GPU Thermal Pad

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP800
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Ultra Soft Laptop GPU Thermal Pad

Description
Product Name: Ultra Soft Ceramic Filler Thermal Pad Material With 8.0w Thermal Conductivity Composition: Ceramic Filler + Silicone
Thermal Conductivity: 8.0±0.5(W/m.K) Hardness: 55±10(Shore OO)
Usage Temperature: -40~150(℃) Breakdown Voltage: ≥6.0(kv/mm)
High Light:

Laptop GPU Thermal Pad Ultra Soft

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Anti Corrosion Laptop GPU Thermal Pad

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Tasteless Thermal Pad Electronics

Ultra Soft Ceramic Filler Thermal Pad Material With 8.0w Thermal Conductivity

 

TP 800 Series thermal pad is a material with very high thermal conductivity. Its surface consistency is very good. It can be used to fill small gaps and uneven surfaces and make reliable contact with parts of various shapes and sizes. Shows lower thermal resistance and better electrical insulation characteristics under low compression force.
Product features:Thermal conductivity:8.0W/mK,High electrical insulation
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink

 

The thermal pad material has the characteristics of good insulation, die-cutting, easy mass production, no chemical reaction and easy rework. However, the interface thermal resistance of the thermal pad material is higher than that of the liquid thermal conductive product, and the price is high. There is no bonding strength, and the original thickness cannot be restored after long-term use. Changing the shape of the thermal conductive interface requires changing the shape and / or thickness of the die cutting.

 

Some thermal pad material are very hard and brittle, such as tofu dregs, which will break when folded. However, TP series thermal pad material have low hardness, high elasticity, certain tensile strength, elongation and tear resistance, and can withstand 40% to 50% compression deformation. They have relatively low requirements for engineers' design work, which greatly facilitates production and processing.

 

How to select the thickness of thermal pad material? This depends on the specific application, and is also related to the pressure that the device can withstand. A compression ratio of 10-20% is enough. The general compression ratio of thermal conductive silica gel sheet is about 10-20%, and the soft thermal conductive silica gel can reach 30-40%. The greater the pressure, the greater the compression deformation, and the greater the pressure the device bears. The main function of thermal conductive silicon film is to eliminate the air between the contacts, so that they do not produce gaps, and fully contact to achieve good thermal conductivity. Thermal conductive silica gel has good contact and weak viscosity. The thinner the thermal pad material, the smaller the thermal resistance, and the better the heat conducting effect.


Product feature
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
■ High compression rate
■ Low compression force


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Purchase information:

 

Ultra Soft Laptop GPU Thermal Pad 0

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

 

Ultra Soft Laptop GPU Thermal Pad 1

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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