|
Product Details:
|
| Product Name: | Light Blue Thermal Conductive Liquid Gap Filler Silicon Pad Gel For Cooling LEDs | Composition: | Ceramic Filler + Silicone |
|---|---|---|---|
| Color: | Light Blue | Density: | 3(g/cc) |
| Usage Temperature: | -40 ℃ ~ 150 ℃ | Flammability: | V-0 |
| Thermal Conductivity: | 3.0 W/m.K | ||
| High Light: | Multipurpose Liquid Gap Filler,Liquid Gap Filler Anti Seismic,Anti Seismic Thermal Gap Fillers |
||
Light Blue Thermal Conductive Liquid Gap Filler Silicon Pad Gel For Cooling LEDs
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic filler + Silicone | - |
| Color/Component A | White | Visual |
| Color/Component B | Light Bule | Visual |
| Density(g/cc) | 3 | ASTM D792 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
| Viscosity/Component A (cps) | 400000 | ASTM D2196 |
| Viscosity/Component B (cps) | 400000 | ASTM D2196 |
| Hradness,after cure(shore OO) | 40 | ASTM D22240 |
Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5 W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
Typical applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
Two-part dispensable gap filler
Liquid Gap Filler is a soft silicone-based thermal gap filler material with high thermal conductivity, low interface thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. It is filled between the electronic components to be cooled and the radiator/housing, etc., to make them come in close contact, reduce thermal resistance, and quickly and effectively reduce the temperature of the electronic components, thereby prolonging the service life of the electronic components and improving their reliability.
Purchase information
Packing specification: 50 ml(25 ml each part) / 400 ml(200 ml each part)/20kg (10kg each part)
Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour
Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.
Contact Person: Jason Zhan
Tel: +8613923884646
