|Product Name:||Light Blue Thermal Conductive Liquid Gap Filler Silicon Pad Gel For Cooling LEDs||Composition:||Ceramic Filler + Silicone|
Multipurpose Liquid Gap Filler,
Liquid Gap Filler Anti Seismic,
Anti Seismic Thermal Gap Fillers
Light Blue Thermal Conductive Liquid Gap Filler Silicon Pad Gel For Cooling LEDs
TF Series liquid gap fillers are supplied as a two-component, room or elevated temperature curing systems, resulting in a soft, thermally conductive, form-in-place elastomer ideal for coupling heat producing devices with an adjacent metal case or heat sink. Thermally conductive liquid gap fillers are primarily for applications where stronger structural bonds are not required. If structural bonding is needed, Henkel thermal adhesives area an ideal solution.If structural bonding is needed, AOK thermal adhesives area an ideal solution.
TF Series Thermal Conductive Gap Filler are two-part, 1:1 ratio, ceramic filled silicone dispensable gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high tolerances are present and designs require reduced mechanical stresses.
Understanding the intricacies of balancing filler content, thermal conductivity requirements and equipment integrity, AOK gap fillers are optimized liquid gap filler materials that can be deposited in extremely high volume for industries like automotive where large systems require maximum heat dissipation. AOK has established strategic equipment partnerships with the world’s leading automated dispensing equipment companies and can customize solutions for dynamic applications.
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays
Two-part dispensable gap filler
Liquid Gap Filler is a soft silicone-based thermal gap filler material with high thermal conductivity, low interface thermal resistance and good thixotropy. It is an ideal material for applications with large gap tolerances. It is filled between the electronic components to be cooled and the radiator/housing, etc., to make them come in close contact, reduce thermal resistance, and quickly and effectively reduce the temperature of the electronic components, thereby prolonging the service life of the electronic components and improving their reliability.
Packing specification: 50mL(25mL each part) / 400ml(200mL each part)/20kg (10kg each part)
Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour
Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Light Bule||Visual|
|Breakdown Voltage(kv/mm)||≥7.0||ASTM D149|
|Dielectric Constant(@10mhz)||7.3||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^13||ASTM D257|
|Thermal conductivity(W/m.K)||3.0||ASTM D5470|
|Viscosity/Component A (cps)||400000||ASTM D2196|
|Viscosity/Component B (cps)||400000||ASTM D2196|
|Hradness,after cure(shore OO)||40||ASTM D22240|
Contact Person: Jason Zhan