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Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose
Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Large Image :  Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TF
Payment & Shipping Terms:
Minimum Order Quantity: 400ml(200ml each part)
Packaging Details: 50ml(25ml each part)/ 400ml(200ml each part)/ 20kg(10kg each part)
Delivery Time: 13-15 working days
Payment Terms: T/T

Practical Soft Silicone CPU Thermal Paste Anti Insulation Multipurpose

Description
Product Name: Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler Composition: Ceramic Filler + Silicone
Usage Temperature: -40 ℃ ~ 150 ℃ Dielectric Constant: 7.0(@10mhz)
Viscosity/Component A: 400000 (cps) Viscosity/Component B: 400000 (cps)
High Light:

Practical CPU Thermal Paste

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Anti Insulation CPU Thermal Paste

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Multipurpose Silicone Thermal Paste

Thermal Paste CPU Soft Silicone Gel Liquid Gap Filler For Heat Cooler

 

Attribute Value Test Method
Composition Ceramic filler + Silicone -
Color/Component A White Visual
Color/Component B Light Bule Visual
Density(g/cc) 3 ASTM D792
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 7.3 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 3.0 ASTM D5470
Viscosity/Component A (cps) 400000 ASTM D2196
Viscosity/Component B (cps) 400000 ASTM D2196
Hradness,after cure(shore OO) 40 ASTM D22240

 

Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications

 

Typical applications

 

■Applications that require one-part dispensing
■Any design where vertical gap stability and no pump out are required
■Devices demanding low assembly pressure
■Automotive electronics (ADAS, HEV, NEV, batteries, ECU)
■Telecommunications
■Computer and peripherals
■Between heat-generating semiconductors and a heat sink

■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Memory Modules
■ Industrial: LEDs, Power Supplies
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, LCD TVs, Displays

 

Two-part dispensable gap filler

TF Series Thermal Conductive Gap Filler products are two-component pre-formed thermally conductive silicone products, which mainly meet the requirements of low stress and high compressive modulus when the product is in use, and can realize automatic production; it has good contact with electronic products when assembling. A low contact thermal resistance and good electrical insulation characteristics. The cured thermally gap filler is equivalent to a thermally conductive pad, with good high temperature resistance and aging resistance, and can work for a long time at -40~200℃.

 

Purchase information
Packing specification: 50mL(25mL each part) / 400ml(200mL each part)/20kg (10kg each part)

 

Directions for use
• Working hours @ 25
C : 1 hour
• Dry to touch @ 25
C : 1 hour
• Full cure @ 25
C : 12-16 hours
• Full cure @ 100
C : 1 hour

 

Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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