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RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks

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China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
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The LT is amazing, product looks good. Also the service quite nice.

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The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

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RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks

RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks
RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks

Large Image :  RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP150
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks

Description
Product Name: Thermal Conductive Pad Super Soft Good Thermal Insulation With 1.5w Ultra Soft Thickness: 1.0~10.0(mm)
Thermal Conductivity: 1.5±0.1(W/m.K) Density: 2.5 (g/cc)
Flammability: V-0 Hardness: 20±5 (Shore OO)
High Light:

1.5 W/MK Thermal Conductive Pad

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Notebooks Thermal Conductive Pad

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RoHS Thermal Insulation Pad

Thermal Conductive Pad Super soft good thermal insulation with 1.5w Ultra Soft

 

TP150 is an extremely soft gap filler pad, specifically designed to many design needs. With a shore hardness of 40 (Shore 00) and thermal conductivity of 1.5 W/ mK, TP 150-S provides that added thermal performance that lower thermal pads cannot meet without sacrificing hardness or contact resistance.

 

Thermal Conductive Pad is a thermally conductive, reinforced material rated at a thermal conductivity of 1.5 W/mK, low thermal resistances can be achieved at low pressures. This soft interface pad conforms well to minimal pressure, resulting in excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography.

 

thermal conductive pad has excellent compressibility and insulation, which can be used to fill the air gap between the heating device and the heat sink or the metal base, so that there can be good heat transfer between the heat dissipation location and the heating location. Soft and elastic, it can cover the uneven surface, thus improving the efficiency of heating electronic components and extending the service life of electronic equipment. In addition, the product also has the function of damping, sealing and so on, can achieve the design requirements of equipment miniaturization and ultra-thin, it is a kind of product with practicability and technicality.

 

"Thermal pad" is a thermal conductive medium material synthesized by special process with silica gel as the base material and metal oxide and other auxiliary materials. In the industry, it is also known as thermal conductive silica gel pad, thermal silicon film, soft thermal conductive pad, thermal conductive silica gel pad and so on. thermal pad are used for filling the two contact surfaces.They are ultra soft and have good resilience,so effectively exclude air from the contact interface. The products are naturally tacky,can be die-cut into various shapes,easy to operate. Our products have passed 1000 hours cold and hot shock test,1000 hours double 85 test,1000 hours high temperature aging test,Committed to providing more reliable heat conduction solutions for automobile, communication, security and other industries. 

 

Product feature


■ Thermal conductivity: 1.5 W/m.k
■ Soft and highly compliant
■ Naturally tacky, easing application
■ Low pressure versus deflection
■ Excellent, high volume applications

 

Typical applications


■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ Industrial: LEDs, Power Supplies and Conversion
■ Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks 0

 

RoHS 1.5W/MK Thermal Conductive Pad Anti Insulation For Notebooks 1

 

 

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Light Grey Visual
Thickness(mm) 1.0~10.0 ASTM d374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 40±5 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(Kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@1MHz) 6.66 ASTM D150
Volume Resistivity(Ω.cm) 10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.5±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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