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Multiscene Laptop CPU Thermal Pad

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China Shenzhen Aochuan Technology Co., Ltd certification
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Multiscene Laptop CPU Thermal Pad

Multiscene Laptop CPU Thermal Pad
Multiscene Laptop CPU Thermal Pad Multiscene Laptop CPU Thermal Pad

Large Image :  Multiscene Laptop CPU Thermal Pad

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Multiscene Laptop CPU Thermal Pad

Description
Product Name: Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation Composition: Ceramic Filler, Silicone, And Reinforced Fiberglass
Color: White And Brick Red Thickness: 0.5~12.0 (mm)
Density: 2.5(g/cc) Hardness: 30±5(Shore OO)
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Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation

 

UTP 100 is an extremely soft gap filler pad with a fiberglass reinforced liner, on one side . This combination allows for high breakdown voltage and cut through resistance, while providing the desirable low contact resistance and tolerance pickup of gap filling pads . UTP 100 versatility lends itself to a multitude of designs.

 

UTP series products are made by using silica gel and thermal conductive ceramic filler, adding glass fiber cloth as reinforcement material, and processed by special technology. With single-sided self-adhesive type, anti puncture and high breakdown voltage, it is a very soft thermal pad with excellent compressibility. It can be in close contact with electronic components, effectively reduce the interface resistance, and has excellent thermal conductivity.

 

As a kind of flexible heat conducting material, UTP series is widely used in the gap filling between heating elements and radiating elements. In addition to the role of interface heat transfer, it can also play the role of insulation, shock absorption and buffer, absorption tolerance and so on.

 

 

 

It is mainly made of silica gel. Silica gel itself has no pollution, no special smell and will not harm human body. In addition, from its performance, it is installed in electronic products as an accessory for heat transfer. The temperature of electronic products is in a relatively stable state in the use engineering, which is not only to protect the machine, but also from the point of view of safety. It has insulating properties, so it will not cause harm in the process of using electronic products, and it also has the function of shock and fall prevention.

 

Product feature:

■ Thermal Conductivity:1.0 W/ mK
■ Ultra soft and highly compliant
■ Naturally tacky on one side
because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;

 

Typical applications:
■ Networking and Telecommunications
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Multiscene Laptop CPU Thermal Pad 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

 

Multiscene Laptop CPU Thermal Pad 1

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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