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Multiscene Laptop CPU Thermal Pad

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

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Multiscene Laptop CPU Thermal Pad

Multiscene Laptop CPU Thermal Pad
Multiscene Laptop CPU Thermal Pad Multiscene Laptop CPU Thermal Pad

Large Image :  Multiscene Laptop CPU Thermal Pad

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Multiscene Laptop CPU Thermal Pad

Description
Product Name: Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation Composition: Ceramic Filler, Silicone, And Reinforced Fiberglass
Color: White And Brick Red Thickness: 0.5~12.0 (mm)
Density: 2.5(g/cc) Hardness: 30±5(Shore OO)
High Light:

Laptop Thermal Pad

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CPU Thermal Pad

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Ultra Soft Thermal Pad

Ultra Soft Thermal Pad Ultra Soft Custom Silicon Thermal Pad For Heat Dissipation

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*1013 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470
 

 

Product feature:

■ Thermal Conductivity:1.0 W/m.K
■ Ultra soft and highly compliant
■ Naturally tacky on one side
■ 
because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ 
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;

 

Typical applications:
■ Networking and Telecommunications
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

 

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Multiscene Laptop CPU Thermal Pad 0

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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