|Product Name:||Grey Thermal Conductive Pad For For Heat Conduction Of LED With 2.0W/mK Gap Filler||Density:||2.8 (g/cc)|
|Dielectric Constant:||7.0 （@10mhz）||Thermal Conductivity:||2.0±0.1（W/m.K）|
Automotive Thermal Conductive Pad,
Heat Sink Thermal Conductive Pad,
Ultrasoft Thermal Pad For Heat Sink
Grey Thermal Conductive Pad for for heat conduction of LED with 2.0W/mK gap filler
TP200 thermal conductive pad, is key when your thermal needs begin to changed from design enhancement to thermal requirement. At 2.0 W/mK, TP200 begins to add that extra thermal punch many designs require to keep specifications within thermal design targets. TP200 is a no substrate, ultra-thin thermal material rated at a thermal conductivity of 2W/mK, low thermal resistances can be achieved at low pressures and allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances. TP200 is applied to heating units in narrow space, and is naturally tacky, and no adhesive coating is required.
Thermal conductive silicone gap pad is specially designed for the purpose of high-performance thermal conductivity.
Standard size: 400mm*200mm, according to customer needs to cut the shapes.
Basic thickness 0.15~10mm, the special thickness can be customized.
The product itself is slightly viscous if need to strengthen the adhesive can be according to customer's requirement.
Product color is mass production if need special color can be adjusted to the actual situation.
thermal pad is specially produced for the design scheme of using the gap to transfer heat. It can fill the gap, open the heat channel between the heating part and the heat dissipation part, effectively improve the heat transfer efficiency, and also play the role of insulation, shock absorption and sealing. It can meet the design requirements of miniaturization and ultra-thin equipment. It is an excellent heat conduction filling material with great processability and usability, and wide thickness application range.
High heat transfer efficiency, low thermal resistance, stable performance
Ultra soft and highly compliant
Naturally tacky, easing application
Low pressure versus deflection
Low viscosity on both sides, easy to install and reusable
Networking and Telecommunications
IT: Notebooks, Tablets, Power Conversion
Industrial: LEDs, Power Supplies and Conversion
Automotive: Control Modules, Turbo Actuators
Consumer Electronics: Gaming Systems, and LCDs
|Composition||Ceramic Filler + Silicone||-|
|Hardness(shore oo)||25||ASTM D2240|
|Breakdown Voltage(Kv/mm)||6.0||ASTM D149|
|Dielectric Constant(@10Mhz)||7.0||ASTM D150|
|Volume Resistivity(Ω.cm)||10^13||ASTM D257|
|Thermal conductivity(W/m.K)||2.0||ASTM D5470|
Contact Person: Jason Zhan