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Product Details:
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| Product Name: | Cpu Light Blue Liquid Gap Filler Cooling Silicone Thermal Paste | Thermal Conductivity: | 3.0（W/m.K） |
|---|---|---|---|
| Viscosity/Component A: | 400000 (cps) | Viscosity/Component B: | 400000 (cps) |
| Color: | Light Blue | Composition: | Ceramic Filler + Silicone |
| High Light: | Computers Liquid Gap Filling,Nontoxic Thermal Conductive Filler,thermally conductive Gap Filler |
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Cpu Light Blue Liquid Gap Filler Cooling Silicone Thermal Paste
| Attribute | Value | Test Method |
|---|---|---|
| Composition | Ceramic filler + Silicone | - |
| Color/Component A | White | Visual |
| Color/Component B | Light Bule | Visual |
| Density(g/cc) | 3 | ASTM D792 |
| Usage Temperature(℃) | -40~150 | -- |
| Electrical | ||
| Breakdown Voltage(kv/mm) | ≥7.0 | ASTM D149 |
| Dielectric Constant(@10mhz) | 7.3 | ASTM D150 |
| Volume Resistivity(Ω.cm) | 1.0*1013 | ASTM D257 |
| Flammability | V-0 | UL94 |
| Thermal | ||
| Thermal conductivity(W/m.K) | 3.0 | ASTM D5470 |
| Viscosity/Component A (cps) | 400000 | ASTM D2196 |
| Viscosity/Component B (cps) | 400000 | ASTM D2196 |
| Hradness,after cure(shore OO) | 40 | ASTM D22240 |
Purchase information
Packing specification: 50ml(25ml each part) / 400ml(200ml each part)/20kg (10kg each part)
Directions for use
• Working hours @ 25C : 1 hour
• Dry to touch @ 25C : 1 hour
• Full cure @ 25C : 12-16 hours
• Full cure @ 100C : 1 hour
Storage & Shelf life
Store in a cool, dry, well ventilated place. Shelf life of the product is 6 months after date of shipment.
TF Series Thermal Conductive Gap Filler are two-part, 1:1 ratio, ceramic filled silicone dispensable gap fillers. Curing at room temperature lends itself to high volume automation. Typical applications are where high tolerances are present and designs require reduced mechanical stresses. Graphene reinforced single component precuring heat conducting gel is applied to all kinds of components with low stress
requirement to make the products have high reliability. The product is self-adhesive and easily assembled. Meanwhile, customers
can automatically dispense glue according to their own process to improve production efficiency.
Product feature
■ Thermal conductivity: 1.5,2.0,3.0,3.5W/m.K
■ Room temperature cure
■ Highly compliant
■ Low pressure vs. deflection
■ High volume applications
Contact Person: Jason Zhan
Tel: +8613923884646
