Product Name:1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant
Usage Temperature:-40 ℃ ~ 150 ℃
Composition:Silicone
Product Name:1.0W/m.K Thermal Conductivity Two Parts Silicone Base Gel Thermally Conductive Encapsulant
Usage Temperature:-40~150（℃）
Thermal Resistance:0.15 (℃-in2/W)0.1mm@50psi
Product Name:Organic Silicone High Thermal Conductivity Encapsulating With Silicon For LED Thermal Cycle
Usage Temperature:-40 ℃ ~ 150 ℃
Viscosity/Component A:4500 cps
Product Name:Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With OBC
Composition:Ceramic filler + Silicone
Density:1.8(g/cc)
Product Name:Waterproof Thermally Conductive Encapsulant Silicone Sealant For Led Encapsulation
Color:White
Breakdown Voltage:≥10 kv/mm
Product Name:Fast Curing Thermally Conductive Encapsulant Potting Compound Silicone With LED
Dielectric Constant:5.5（@10mhz）
Flammability:V-0
Product Name:Black Thermally Conductive Encapsulant Transparent Silicone Encapsulant For LED
Composition:Ceramic filler + Silicone
Breakdown Voltage:≥10（kv/mm）
Product Name:High Thermal Conductivity Encapsulating Low Viscosity heat conducting material With Silicon For OBC
Composition:Ceramic filler + Silicone
Color:White
