|Product Name:||0.8 W/M.K Room Temperature Curing Thermally Conductive Silicone Encapsulant For Led||Composition:||Silicone|
|Thermal Conductivity:||0.8 W/m.K||Usage Temperature:||-40~150（℃）|
LED Silicone Thermally Conductive Encapsulant,
LED Thermally Conductive Encapsulant,
0.8W/M.K Thermal Conductive Compound
0.8 W/M.K Room Temperature Curing Thermally Conductive Silicone Encapsulant For Led
GF series thermally conductive potting encapsulant provides thermal conductivity and electrical insulative characteristics delivered in a two part dispensable and easily automated product. Additionally, the GF series provides protection from shock, dust, water, and vibration.
The core components of LED driving power supply mainly include: switch controller, inductor, switch components, feedback resistance, input filter, output filter, etc. LED is an energy-saving product, so the efficiency of driving power supply should be high. It is also very important for the heat dissipation of the structure where the power supply is installed in the lamp. The efficiency of the power supply is high, its power consumption is small, and the heat generation in the lamp is small, which reduces the temperature rise of the lamp. It is beneficial to delay the light failure of LED.
In the prior art, in order to get good insulation protection for the driving power supply, the driving power supply is usually assembled in a sealed cavity, which is actually particularly detrimental to the heat dissipation of the driving power supply. To meet this challenge, the selected heat conducting materials must meet the performance of heat dissipation, insulation and waterproof at the same time. The correct installation and good insulation of the products will enhance the vitality of the LED power supply.
The application of thermally conductive silicone encapsulant to potting the driving power supply can not only achieve the effects of insulation and fixation, waterproof and anti vibration, but also improve the heat dissipation capacity of the driving power supply and ensure that the driving power supply can work stably for a long time. Chip heating is mainly aimed at the high-voltage drive chip with built-in power modulator. The power consumption of the chip can be distributed to devices outside the chip through thermal conductive silicone grease and thermal conductive silicone sheet. The thermal conductive insulating sheet is used for power devices to ensure insulation performance while transferring heat.
■ Thermal conductivity: 1.0~2.0W/m.K
■ Electrically insulating
■ High conformability
■ Flexible working time
■ Industrial: LEDs, Power Supplies
■ Automotive: OBC, DC/DC Converter, Amplifiers
■ Consumer Electronics: DC Converters, High Voltage Applications
Packing specification: 50mL(25mL each part)/ 400ml(200mL each part)/ 20kg(10kg each part)
Directions for use
• Working time @ 25C: 30-120 min
• For best results, ensure a 1:1 mix ratio is maintained
• Full cure @ 25C: 4 hours
• Full cure @ 100C: 5 minutes
Store in a cool, dry, well-ventilated place.
Shelf life of the product is 12 months after date of shipment.
|Composition||Ceramic filler + Silicone||-|
|Color/Component B||Sliver Grey||Visual|
|Breakdown Voltage(kv/mm)||≥10.0||ASTM D149|
|Dielectric Constant(@10mhz)||5.5||ASTM D150|
|Volume Resistivity(Ω.cm)||1.0*10^15||ASTM D257|
|Thermal conductivity(W/m.K)||0.8||ASTM D5470|
|Viscosity/Component A (cps)||4500||ASTM D2196|
|Viscosity/Component B (cps)||4500||ASTM D2196|
|Hradness,after cure(shore OO)||60||ASTM D22240|
|Working Time@25℃(min)||30||ISO 9048|
Contact Person: Jason Zhan