|Product Name:||10.0mm Thickness 2.9g/Cc Density No Volatilization Silicon Free Thermal Pad||Thickness:||1.0~10.0 Mm|
|Breakdown Voltage:||≥6.0（kv/mm）||Thermal Conductivity:||2.0±0.1（W/m.K）|
Puncture Resistant Thermal Laptop Pad,
Multipurpose Thermal Laptop Pad,
Weather Resistant Thermal Pad With Paste
10.0mm Thickness 2.9g/Cc Density No Volatilization Silicon Free Thermal Pad
Compared with the traditional thermal conducting silica pad, the silicon free thermal pad has the obvious advantage that the content of low molecular siloxane is zero, which solves the problem of silicone oil volatility that many engineers worry about.
Silicon free thermal pad can solve the heat conduction problem of most PCB boards; After long-term repeated tests, low molecular siloxane did not precipitate, which is much better than the international thermal conductive silicone gasket used before. The thermal conductivity is also 3.0w/m.k, which not only cools down better, but also after rework, the PCB board is removed very clean without dirt on it. The heat conducting silica gel used in the early stage was removed from the machine, and there were many oil stains on the surface, which could not be used, affecting the use experience of end users.
The silicon free thermal pad is a non-volatile heat conducting gasket without silicone oil. The silicone oil will leak out after the traditional heat conducting silicone sheet is heated. In order to meet the needs of notebook computers, projectors and OA office electronic products, industrial control and electronics, automotive engine control equipment, telecommunications hardware and equipment and other special fields.
1. No siloxane component;
2. Conform to Rosh standard;
3. Good thermal conductivity: 1.5~3.0 w/mk;
4. High compressibility, soft and elastic, suitable for low pressure applications;
5. Various thickness options are available.
■ Thermal conductivity:2.0,3.0W/m.K
■ Naturally tacky, easing application
■ Silicone free
■ Excellent, high volume applications
■ Excellent electrical isolation
■ Excellent compression vs. deflection performance.
■ No siloxane volatilization
■ High thermal conductivity
■ High insulation
■ High compressibility
■ Fiber Optics
■ Medical Device
■ Hard Disc Driver
■ Automotive Sensors and Modules
■ Silicon Sensitive Components
■ Hard disk
■ Optical precision equipment
■ Notebook computer, projector and OA office electronic products
■ Mobile and communication equipment, high-speed mass
■ Storage drives, heat pipe assemblies, automotive engine control equipment
■ Telecommunication hardware and equipment, high-end industrial control and medical electronics
Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm
|Hardness(shore oo)||45±5||ASTM D2240|
|Breakdown Voltage(kv/mm)||≥6.0||ASTM D149|
|Thermal conductivity(W/m.K)||2.0||ASTM D5470|
Contact Person: Jason Zhan