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RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch

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RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch

RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch
RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch

Large Image :  RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: TP
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch

Description
Product Name: 8.0w/M.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch Composition: Silicone
Hardness(shore Oo): 55 Thermal Conductivity: 8.0±0.5(W/m.K)
Thickness: 0.5~10(mm) Density: 3.35 (g/cc)
High Light:

RoHS Thermal Pad Material

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Reusable Thermal Pad Material

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8W/MK Reusable Thermal Pad

8.0w/M.K Thermal Conductivity Thermal Pad Silicone Material For Network Switch

 

With the rapid development of science and technology, our society has entered the information age. In this society, the network has become an indispensable part of people's life. With the rapid development of the information age and the gradual popularization of cloud services, the amount of data storage in all walks of life has increased rapidly due to the popularization of cloud services. Large capacity expansion of servers also brings more switch requirements. Network switch is an important component to connect servers and network equipment and build data center. Due to the high density of network devices caused by the popularity of cloud services, the surge in the number of connected devices makes the switch load greater. Due to the fatal impact of high temperature on industrial switches, in the design of such products, in addition to selecting industrial components with wide temperature range, we should pay more attention to the thermal design of equipment.

 

In order to meet the reliability application requirements of industrial switches, most of the whole machine adopts the fan less heat dissipation design. For chips with large heat generation, Thermal Pad Silicone Material can be used to fill the gap between the contact surface and form a heat conducting channel from the chip surface to the shell, so as to ensure that the chip works in a safe temperature range and that the switch can work reliably and safely in a high temperature environment. The Thermal Pad Silicone Materialis mainly used for heat conduction and heat dissipation between the main board and the shell. The main purpose of selecting the Thermal Pad Silicone Material is to reduce the contact thermal resistance between the heat source surface and the contact surface of the radiator. The Thermal Pad Silicone Material can well fill the gap of the contact surface; With the supplement of Thermal Pad Silicone Material, the contact surface between the heat source and the radiator can be in better and full contact, so as to truly achieve face-to-face contact, and the temperature response can achieve the minimum temperature difference; The Thermal Pad Silicone Material not only has the insulating property, but also has the effect of shock absorption and sound absorption.

 


Product feature
■ Thermal conductivity:8.0W/mK
■ High thermal conductivity
■ Low oil permeability
■ High electrical insulation
Good processing performance, convenient installation and pressing;
It has good elasticity and resilience, and can adapt to pressure changes and temperature fluctuations;

 


Typical applications
■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
■ CD ROM/DVD ROM
■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.

 

Purchase information:

 

RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch 0

Standard size: T≤1.5mm,size=200*400mm; T>1.5mm,size=150*150; which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm.

 

RoHS Reusable Thermal Pad Material Silicone 8W/MK For Network Switch 1

 

 

Attribute Value Test Method
Composition Ceramic Filler + Silicone -
Color Pink Visual
Thickness(mm) 0.5~10 astm d374
Density(g/cc) 3.35 ASTM D792
Hardness(shore oo) 55±10 ASTM D2240
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) >6.0 ASTM D149
Dielectric Constant(@10mhz) 7.2 ASTM D150
Volume Resistivity(Ω.cm) 10^12 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 8.0±0.5 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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