Home ProductsUltra Soft Thermal Pad

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

Certification
China Shenzhen Aochuan Technology Co., Ltd certification
China Shenzhen Aochuan Technology Co., Ltd certification
Customer Reviews
The LT is amazing, product looks good. Also the service quite nice.

—— Volkan Sandra

The quality and performance of the thermal pad met expectations, the service attitude was good, and the goods were received soon.

—— Thomas Gereen

I'm Online Chat Now

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad
Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

Large Image :  Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400mmx200mm
Delivery Time: 13-15working days
Payment Terms: T/T

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad

Description
Product Name: 1.0w/M.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch Volume Resistivity: 1.0*10^13(Ω.cm)
Flammability: V-0 Thermal Conductivity: 1.0 W/m.K
Composition: Ceramic Filler, Silicone, And Reinforced Fiberglass Thickness: 0.5~12.0 (mm)
High Light:

Practical Thermal Paste Pad

,

Multiscene Thermal Paste Pad

,

Network Silicone CPU Pad

1.0w/M.K Thermal Conductivity Ultra Soft Silicone Thermal Pad For Network Switch

 

In AI Artificial Intelligence, Smart speakers are the product of its wave. As a manufacturer of thermal conductive materials, we want to provide corresponding solutions for the design and production of these network intelligent devices in the ai artificial intelligence industry.

 

The circuit board of AI Smart speaker is attached with many electronic components, such as master control chip, memory, etc. the heat generated is quite large. It is inevitable to solve the problem of heat conduction. The solution is to use heat conducting silica gel to conduct heat dissipation. Some brands of smart speakers open the aluminum alloy heat dissipation shell, you can see that there is a vertical motherboard, which is also covered with a relatively small aluminum heat sink, and below is the main control chip. Open the aluminum heat sink and you can see that there is a piece of heat conducting silica gel attached to it.

 

In addition, heat conducting silica gel sheets are also used inside the circuit board shield, memory, PMIC and processor to enhance the heat dissipation performance. The heat is transferred to the metal heat sink through the heat conducting silica gel sheet, and then dispersed. This is also the heat dissipation structure design of many electronic devices.

 

 

Product features: Thermal Conductivity:1.0W/mK, Ultra Soft, Reinforced Gap Filler Pad
Typical applications: Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

 

Product feature:
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ pink pad
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad 0

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

 

Practical Multiscene Thermal Paste Pad , Network Silicone CPU Pad 1

 

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

Send your inquiry directly to us (0 / 3000)