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AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook

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AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook

AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook
AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook

Large Image :  AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook

Product Details:
Place of Origin: China
Brand Name: AOK
Certification: RoHS, Reach, UL
Model Number: UTP100
Payment & Shipping Terms:
Minimum Order Quantity: 1000pcs
Packaging Details: 400 mm x 200 mm
Delivery Time: 13-15 working days
Payment Terms: T/T

AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook

Description
Product Name: 1.0 W/m.K 30 Shore OO Hardness Ultra Soft Thermal Silicone Pad For Notebook Hardness: 30 Shore Oo
Thermal Conductivity: 1.0 W/m.K Composition: Silicone
Color: White And Brick Red Thickness: 0.5~12.0 Mm
High Light:

AOK Ultra Soft Thermal Pad

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1W/MK Ultra Soft Thermal Pad

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30 Shore OO Notebook Thermal Pad

 

1.0 W/m.K 30 Shore OO Hardness Ultra Soft Thermal Silicone Pad For Notebook

 

Ultra soft thermal silicone pad are widely used in many industries, especially in the electronic manufacturing industry. The notebook computer is thin and narrow, and the heat is concentrated: compared with the traditional desktop computer, the notebook computer we use is light and thin, which is convenient to carry around. Because the internal space of the notebook is relatively narrow, many high calorific value components are accumulated inside, which brings great pressure to the heat dissipation.

 

The ultra soft thermal silicone pad has good thermal conductivity, easy operation and good adhesion: the ultra soft thermal silicone pad not only has good thermal conductivity and heat dissipation, but also is easy to operate. The thermal conductive silicon film is used as the thermal interface material for the components with small calorific value, so as to solve the heat transfer from the heating element device to the heat pipe, and make the heat flow through the air duct and air to achieve the purpose of heat dissipation quickly and evenly. In addition, the thermal conductive silicone sheet has good self-adhesive property, so it can be operated repeatedly in the narrow space of the notebook, and will not have any adverse impact on the performance of the notebook. The thermal conductive silica gel sheet has electrical insulation, temperature resistance, small thermal resistance, good compressibility, etc., so its performance will not be affected when the notebook is working under continuous high heat. Therefore, this is the reason why the heat dissipation of notebook computer can not be separated from thermal conductive silicon film.

 

UTP series thermal pad is made of soft silica gel thermal conductive material, which has the characteristics of good thermal conductivity, insulation, softness and elasticity. It is placed between the power heating device and the heat dissipation structure to effectively transfer the heat generated by the power module to the heat dissipation components to realize the heat dissipation of the system. It has self-adhesive property and is easy to apply without additional back glue. It can be cut into any size and shape according to the requirements of application environment to meet different design needs.

 

 

Product features:Thermal Conductivity:1.0 W/m.K,Ultra Soft, Reinforced Gap Filler Pad
Typical applications:Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.

 

Product feature:
the material is soft, good compression performance, good thermal insulation performance, adjustable thickness range is relatively large, suitable for filling the cavity, both sides have natural viscosity, operability and maintainability;
■ pink pad
■ Naturally tacky on one side
■ High cut through resistance
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

 

Typical applications:
■ Networking and Telecommunications
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Industrial: LEDs, Power Supplies and Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

 

Purchase information:

 

AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook 0

Standard size: 200 mm * 400 mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25 mm

 

AOK 1 W/m.K Ultra Soft Thermal Pad 30 Shore OO Hardness For Notebook 1

 

 

Attribute Value Test Method
Composition Ceramic Filler, Silicone, and Reinforced Fiberglass -
Color White and Brick Red Visual
Thickness(mm) 0.5~12.0 ASTM D374
Density(g/cc) 2.5 ASTM D792
Hardness(shore oo) 30±5 ASTM D2240
Tensile Strength(KN/m) 2.5 ASTM D624
Elongation(%) 60 ASTM D412
Usage Temperature(℃) -40~150 --
Electrical    
Breakdown Voltage(kv/mm) ≥7.0 ASTM D149
Dielectric Constant(@10mhz) 5.7 ASTM D150
Volume Resistivity(Ω.cm) 1.0*10^13 ASTM D257
Flammability V-0 UL94
Thermal    
Thermal conductivity(W/m.K) 1.0±0.1 ASTM D5470

 

Contact Details
Shenzhen Aochuan Technology Co., Ltd

Contact Person: Jason Zhan

Tel: +8613923884646

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